FR4, 2OZ copper, 10 Layer with BGA Printed Circuit Board Used For Electronic Control Products
Huaswin Electronics is a professional Printed Circuit Board Manufacturer founded in Shenzhen China.
PCB Clone, PCB Assembly, SMT PCBA Copy:
We can purchase all the components for you for Turnkey service. We can recommend alternate components to help you reduce the costs.
1. PCB File with Parts List provided by customers.
2. PCB boards made, parts purchased by us.
3. PCB boards with parts assembled by us.
4. Testing PCBA for customers (If customer tells us the testing way).
* We can copy PCB or PCBA if customers send samples to us.
Huaswin Company Honor
In order to meet the importance of global economic development on the market
Our Company have been certificated by ISO9000,
And Our Products have been certificated by CE UL, and ROHS.
Special requirements:
Buried and blind vias+controlled impedance +BGA
We are able to offer one-stop 1 to 20 Layer PCB fabrication, PCB manufacturing component sourcing, PCB Assembly, PCBA Test.
PCB capability and services:
1. Single-sided, double side & multi-layer PCB. FPC. Flex-Rigid PCB with competitive price, good quality and excellent service.
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material, Polyimide, etc.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from Sample to mass order
6.100% E-Test
7. Qualified for CE and RoHS certificate
PCBA capability and services: SMT (Surface mounting technology), COB, DIP.
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6. OEM/ODM also welcomed
What we need:
*Gerber files of the bare PCB
*Bill of materials to include: Manufacturer's part number, type of part, type of packaging, component locations listed by reference designators and quantity
*Dimensional specifications for non-standard components
*Assembly drawing, including any change notices
*Final test procedures (if available)
Packing Terms:
(1)Inner packing: All the goods will be packed by vacuum
(2)Outer packing: Standard carton
Quick Leadtime
Lead time for sample:
2-3 days for single-sided board
4-5 days for double-sided board
6-7 days for multilayer board
24-48 hours for urgent
Lead time or opening Mould:
3-5 days for normal mould
5-7 days for hard mould
Lead time for mass production
5-7 days for single/double sided board
7-10 days for multilayer board
Detailed Specification of PCB Manufacturing
1 |
layer |
1-30 layer |
2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
3 |
Board thickness |
0.2mm-6mm |
4 |
Max.finished board size |
800*508mm |
5 |
Min.drilled hole size |
0.25mm |
6 |
min.line width |
0.075mm(3mil) |
7 |
min.line spacing |
0.075mm(3mil) |
8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
9 |
Copper thickness |
0.5-4.0oz |
10 |
Solder mask color |
green/black/white/red/blue/yellow |
11 |
Inner packing |
Vacuum packing, Plastic bag |
12 |
Outer packing |
standard carton packing |
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
15 |
Profiling punching |
Routing,V-CUT,Beveling |