FR4 Immersion Gold PCB / Chip On Board Assembly with nice Epoxy Glop and high quality assured
Specifications:
1. PCB assembled chip on board
2. PCB prototype/PCB mass production and PCB assembly service
3. Competive Price and high quality
4, Surface Mount Technology
5. Through-Hole Assembly Technology
6. Convetional Leaded Technolgoy
7. Special Processes
8. RoHs
9. Inspection Methords
10. Conformal coating
11. Prompt and Superior Service
Detailed Specification of Pcb Assembly
1 |
Type of Assembly |
SMT and Thru-hole |
2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
3 |
Components |
Passives Down to 0201 Size |
BGA and VFBGA |
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Leadless Chip Carries/CSP |
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Double-Sided SMT Assembly |
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Fine Pitch to 08 Mils |
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BGA Repair and Reball |
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Part Removal and Replacement-Same Day Service |
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3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
Largest:20x20 Inches |
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4 |
File Formats |
Bill of Materials |
Gerber Files |
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Pick-N-Place File(XYRS) |
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5 |
Type of Service |
Turn-Key,Partial Turn-Key or Consignment |
6 |
Component Packaging |
Cut Tape |
Tube |
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Reels |
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Loose Parts |
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7 |
Turn Time |
15 to 20 days |
8 |
Testing |
AOI inspection |
X-Ray inspection |
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In-Circuit testing |
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Functional test |
Quality Assurance:
ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management
Quality Processes:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949
Testing:
AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming