4 Layer Blue Solder Mask FR4 Printed Circuit Board

PCB Specifications:

Layer Count: 4 Layer PCB
Material: FR4, TG150
Board Thickness: 1.6MM
Min Hole: 0.3MM
Hole Stucture: L1-L4
Min Trace: 6/6Mil
Unit Size: 175MM*164MM
Solder Mas:Blue
Surface Treatment: OSP
Application: Speaker

Capabilities:

FAQ:

Quesion: What is Organic Solderability Preservative (OSP) or Anti-Tarnish Surface Finish?
Answer: The overall functionality of a PCB board depends upon the conductivity of copper tracks. These tracks tend to oxidize when exposed to the atmosphere, which creates a problem when soldering components on the board. Organic Solderability Preservative (OSP) regulates two things; temporary protection of exposed copper from being oxidized and improving the solderability before component fixation (assembly).
OSP is a very thin (100-4000 Angstroms) organic coating on the PCB board, which is a water-based chemical compound of the ‘Azole family’ such as benzotriazoles, imidazoles, and benzimidazoles. This compound gets absorbed by the exposed copper and generates a protected film.
Advantages of Organic Solderability Preservative:

• Low cost
• Environment-friendly
• Re-workable, but can’t take more than 2-5 rounds of reflow soldering before degradation
• It is lead-free and can handle SMT components easily
• Provides a coplanar surface, well suited for tight-pitch pads (BGA, QFP).

Disadvantages of Organic Solderability Preservative:

• Not Good for PTH (Plated Through Holes)
• Short Shelf Life, less than 6 month
• Inspection is difficult as it is transparent and colorless
• requires careful handling, as it’s susceptible to mechanical damage

OSP Surface Finishing Process:
The OSP finishing process is composed of three major steps that include pre-cleaning and making the PCB board ready to apply a smooth OSP coating:

1. Clean: Organic contaminants such as oil, fingerprints, oxidation film etc. are removed to get a clean PCB board.
2. Topography Enhancement: To improve the bonding forces between exposed copper and OSP film, micro-etching is performed to minimize the oxidation generated on copper.
3. Deionization Rinse: Before the final OSP application, the OSP solution is populated by ions so that it can be eliminated easily during soldering.