6 Layer Printed Circuit Board , FR4 Material , S2600F , Immersion Gold
6 Layer Printed Circuit Board
PCB Specifications:
Layer Count: 6 Layer Rigid PCB:
Material: FR4 S2600F
Board Thickness: 1.6MM
Min Hole: 0.3MM
Min Trace: 5/5Mil
BGA Size: 12Mil
Solder Mask: Green
Surface Treatment: ENIG
Application: Power Supply
Capabilities:
Item | Capability |
Layer Count | 1-24 Layers |
Board Thickness | 0.1mm-6.0mm |
Finished Board Max Size | 700mm* 800mm |
Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
Warp | <0.7% |
Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
Drill Hole Diameter | 0.1mm-6.5mm |
Out Layer Copper Thickness | 1/20Z-8OZ ; |
Inner Layer Copper Thickness | 1/3OZ-6OZ |
Aspect Ratio | 10:1 |
PTH Hole Tolerance | +/-3mil |
NPTH Hole Tolerance | +/-1mil |
Copper Thickness Of PTH Wall | >10mil(25um) |
Line Width And Space | 2/2mil |
Min Solder Mask Bridge | 2.5mil |
Solder Mask Alignment Tolerance | +/-2mil |
Dimension Tolerance | +/-4mil |
Max Gold Thickness | 200u'(0.2mil) |
Thermal Shock | 288C, 10s, 3 Times |
Impedance Contro | +/-10% |
LTest Capability | PAD Size Min 0.1mm |
Min BGA | 7mil |
Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is via in pad
Answer: For some pcbs, due to the limited space, the via holes need to be designed on BGA pad. In order to meet this design requirement, we need to drill the hole on bga pad first, then PTH the hole and use resin to plug in the hole. From the pad surface, we won't see any holes. So it won't affect SMT function.