Specifications
Brand Name :
WITGAIN PCB
Model Number :
P10E3589A0
Certification :
UL Certificate
Place of Origin :
China
MOQ :
negotiable
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
1kkpcs/month
Delivery Time :
25 work days
Packaging Details :
40pcs/bag, 20bags/carton
Material :
FR4, TG170
Board Thickness :
1.0MM
Solder Mask :
Green
Min Hole :
0.1MM
Min Trace :
3/3Mil
BGA :
7 Mil
Surface Treatment :
Immersion Gold
Description

10 Layer HDI Printed Circuit Board , PCB Board , Green Solder Mask , ENIG

PCB Specifications:

Layer Count: 10 Layer HDI PCB

Board Thickness: 1.6MM

Material: FR4 High TG

Min Hole: 0.1MM

Min Line: 3/3 Mil

BGA: 7Mil

Hole: L1-L2, L2-L3, L3-L8, L8-L9, L9-10, L1-L10

Solder Mask: Green

Surface Treatment: ENIG

Application: Consumer Electronics

Capabilities:

Item Capability
Layer Count 1-24 Layers
Board Thickness 0.1mm-6.0mm
Finished Board Max Size 700mm* 800mm
Finished Board Thickness Tolerance +/-10% +/-0.1(<1.0mm)
Warp <0.7%
Major CCL Brand KB/NanYa/LTEQ/ShengYi/Rogers Etc
Material Type FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
Drill Hole Diameter 0.1mm-6.5mm
Out Layer Copper Thickness 1/20Z-8OZ ;
Inner Layer Copper Thickness 1/3OZ-6OZ
Aspect Ratio 10:1
PTH Hole Tolerance +/-3mil
NPTH Hole Tolerance +/-1mil
Copper Thickness Of PTH Wall >10mil(25um)
Line Width And Space 2/2mil
Min Solder Mask Bridge 2.5mil
Solder Mask Alignment Tolerance +/-2mil
Dimension Tolerance +/-4mil
Max Gold Thickness 200u'(0.2mil)
Thermal Shock 288C, 10s, 3 Times
Impedance Contro +/-10%
LTest Capability PAD Size Min 0.1mm
Min BGA 7mil
Surface Treatment OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable

FAQ:

Questions: How many lamination times for this 10 Layer HDI PCB?

Answer: For this PCB, there are 3 times lamination in total.

Questions: What is the normal lead time for this kind of PCB?

Answer: The standard lead time for sample is about 3 weeks, for production is about 4 weeks. It may fluctuate according to production and orders status.

Questions: What is Blind Vias/Blind Holes?

Answer: Blind Vias connect the outermost layer of a multilayer PCB to a layer in the middle of the board. Blind vias can only be seen on one side of the board (that's where they get the name from). These vias enable designers to optimize their circuit layout by providing more space for routing. However, in comparison to Through-Hole Vias they are more difficult to construct and can cause the cost of constructing of the PCB to rise.

10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG

Questions: What Is Buried Vias/Buried Holes?

Anwer: A Buried Via hole connects layers inside a multi-layer PCB. These vias cannot be seen on the surface of a Printed Circuit Board. Buried vias are difficult to construct, as they need to be created in layers within the PCB. Designers like to use these vias, as they do not take up board space on every layer, thereby enabling smaller PCBs. High-density PCBs use buried vias.

10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG

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10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG

Ask Latest Price
Brand Name :
WITGAIN PCB
Model Number :
P10E3589A0
Certification :
UL Certificate
Place of Origin :
China
MOQ :
negotiable
Price :
negotiable
Contact Supplier
10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG
10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG
10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG
10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG
10 Layer HDI PCB Board / Multilayer Pcb Board Green Solder Mask ENIG

Witgain Technology Ltd

Active Member
6 Years
guangdong, shenzhen
Since 2007
Business Type :
Manufacturer
Total Annual :
20000000-25000000
Employee Number :
300~350
Certification Level :
Active Member
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