Advanced PCB Manufacturing: Versatile Substrates & Precise Specifications

PCB Manufacturing Introduction:

Experience excellence with our PCB factory's comprehensive technical specifications. We offer a wide range of insulation materials, including FR4, aluminum, copper, ceramic, PI, and PET. Our capabilities span from 1 to 12-layer boards, ensuring finished plate thickness of 0.07MM and above, with a tolerance of +5%/-6%. Inner layer copper thickness ranges from 18-70μm, and the outer layer copper thickness varies from 20-140μm.

Discover customizable options for solder resistance and lettering in a variety of colors, including red, green, yellow, blue, white, black, and silver. Our surface treatment solutions encompass anti-oxidation, HASL, immersion gold, gold-plated, silver-plated, chain nickel, gold-plated fingers, and carbon oil.

Delve into our special processes, such as thick copper plating, impedance control, high-frequency designs, and unique half-hole orifice and hollow plate configurations. Our products include single-layer copper foil gold finger plates with flexible or rigid combinations, reinforced by materials like Pl, FR4, steel sheet, M glue, and electromagnetic shielding film.

With a maximum size of 50mm x 100mm, we ensure precision with outer and inner line width and spacing of 0.065mm and 0.065 mm3MIL respectively. Expect compliance with minimum solder resist ring width, solder bridge width, solder mask window, and aperture requirements. Impedance tolerance is maintained at 10%, and shape tolerance adheres to +0.05MMG laser and +0.005MM precision.

Choose from forming methods such as V-cut, CNC, and punching to suit your fabrication needs. Experience our commitment to cutting-edge PCB manufacturing that adheres to the highest industry standards.

PCB Manufacturing Parameters:

PCB Manufacturing Process:

1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.

2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)

3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.

4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.

5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.

PCB Manufacturing Advantages:

1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.

2. Quick quotation and quick response.

3. The delivery date is fast, and the on-time delivery rate is over 95%

4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process