PCB Board Assembly Gold Finger Plating SMT/SMD Assembly FR4 Nelco
PCB Board Assembly Description:
PCB Board Assembly Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.5-17.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
PCB Board Assembly Introduction:
We are good at EMS project management and cost reduction. Tongzhan focuses on providing electronic manufacturing services for customers, and we constantly strive to improve all functions and processes of the company. Our goal is to create greatness by providing customers with the best possible service, building profitable solutions for customers, and supporting each other in this process.
Q: What are the benefits of choosing us?
The growing needs of our customers drive our continued growth. The growth management of our PCB layout, fabrication, assembly, and materials is driven by continued pressure to reduce time to market and keep pace with emerging technologies. Co-exhibition capabilities allow our clients to focus on their core competencies such as R&D and sales and marketing.
Q: What are the payment terms we can accept?
We recommend that you use T/T, and other needs can be communicated with our staff.