Specifications
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
100000pc/Month
Delivery Time :
4 Weeks
Packaging Details :
PCB+ Box
Brand Name :
CUSTOM MADE
Certification :
ISO/UL
Keyword :
Printed Circuit Board Assembly PCBA
Surface Finished :
HASL Pb FreeI mmersion Gold
Copper Thickness :
0.3 - 12 oz
Special Capability :
Carbon ink
Minimum Width/Space :
2.4/2.4mil
Materials :
FR4 , High - Tg FR4 , Rogers
Max Board Size :
650mm*1130mm
HDI :
1+n+1、2+n+2、3+n+3
Payment Method :
T/T
Whether to Support customization :
Support
Logistics :
Accept customer specified logistics
Description

Carbon Ink Printed Circuit Board Assembly High - Tg FR4 Immersion Gold + OSP

Printed Circuit Board Assembly Drescription:

The circuit boards we produced including flexible boards, rigid-flex boards, multi-layer boards, blind-hole boards, thick copper and aluminum boards. They are widely used in industrial control, medical care, automotive electronics, communications, Interne.

Printed Circuit Board Assembly Parameters:

Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Min PP Thickness 0.06mm

Printed Circuit Board Assembly Surface Finished:

HASL,HASL Pb FreeI mmersion Gold/Tin/Silver Gold Finger Plating OSP,Immersion Gold+OSP.

Printed Circuit Board Assembly Special Capability:

Gold Finger Plating,Peelable,Carbon ink.

Printed Circuit Board Assembly Introdution:

1. The growth management of our PCB layout, fabrication, assembly and materials is driven by continued pressure to reduce time to market and keep pace with emerging technologies. Co-exhibition capabilities allow our clients to focus on their core competencies such as R&D and sales and marketing.
2. Tongzhan is fully aware of the market pressure of customers. We work according to the client's time, and because we are able to handle everything under one roof in one streamlined process, you get the benefits of working with one company and one timeline.

Carbon Ink Pc Board Assembly High Tg FR4 OSP Printed Wiring Assembly

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Carbon Ink Pc Board Assembly High Tg FR4 OSP Printed Wiring Assembly

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Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
100000pc/Month
Delivery Time :
4 Weeks
Contact Supplier
video
Carbon Ink Pc Board Assembly High Tg FR4 OSP Printed Wiring Assembly

TONGZHAN INDUSTRIAL LIMITED

Active Member
3 Years
shenzhen
Since 2011
Business Type :
Manufacturer
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Active Member
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