Immersion Gold + OSP Electronic Component Sourcing 0.5 - 17.5mm Thickness Nelco
Electronic Component Sourcing Description:
The PCB assembly we produce includes rapid turn prototype PCB assembly, SMT/SMD assembly, through-hole assembly, hybrid technology (SMT/through-hole), turnkey assembly, consignment assembly, etc. They are widely used in industrial control, medical care, automotive electronics, communications, and the Internet. SMT, post welding, assembly to testing one-stop service supports flexible supply.
PCB Manufacturing Parameters:
Item | Technical Parameter |
Layer | 2-64 |
Thickness | 0.3-6.5mm |
Copper Thickness | 0.3-12 oz |
Min Mechanical Hole | 0.1mm |
Min Laser Hole | 0.075mm |
HDI | 1+n+1,2+n+2,3+n+3 |
Max Aspect Ratio | 20:01 |
Max Board Size | 650mm*1130mm |
Min Width/Space | 2.4/2.4mil |
Min Outline Tolerance | ±0.1mm |
Impedance Tolerance | ±5% |
Min PP Thickness | 0.06mm |
Bow &Twist | ≤0.5% |
Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Electronic Component Sourcing Introduction:
All of the components we buy are from original manufacturers or A-level dealers, which means that we will never use old parts, updated parts or parts with old date codes. Full process quality assurance, IPC, and special industry inspection standards.