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Multi Layer PCB Manufacturing Assembly Carbon Ink Nelco Aerospace Pcb Assembly
Multi Layer PCB Manufacturing Assembly Carbon Ink Nelco Aerospace Pcb Assembly
Specifications
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
100000pc/Month
Delivery Time :
4 Weeks
Packaging Details :
PCB + Box
Brand Name :
CUSTOM MADE
Certification :
ISO/UL
Keyword :
PCB Assembly Services
PCB boards :
Metal Substrate Boards, Rigid-flex boards
Surface Finished :
HASL Pb Free Immersion Gold/Silver Osp, Immersion Gold+OSP
Applications :
Medical, Automotive Electronics, Communications,
Materials :
M4,TU862, High-Tg FR4
SMT Capability :
14 million spots per day
Special Capability :
Gold Finger Plating, Peelable
Min Laser Hole :
0.075mm
Payment Method :
T/T
Whether to Support customization :
Support
Logistics :
Accept customer specified logistics
Description

Multi-Layer Boards PCB Assembly Services Producibility Carbon Ink Nelco

PCB Assembly Services Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.


PCB Assembly Services Parameters:

Item

Technical Parameter

Layer

2-64

Thickness

0.5-17.5mm

Copper Thickness

0.3-12 oz

Min Mechanical Hole

0.1mm

Min Laser Hole

0.075mm

HDI

1+n+1,2+n+2,3+n+3

Max Aspect Ratio

20:01

Max Board Size

650mm*1130mm

Min Width/Space

2.4/2.4mil

Min Outline Tolerance

±0.1mm

Impedance Tolerance

±5%

Min PP Thickness

0.06mm

Bow &Twist

≤0.5%

Materials

FR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872

Surface Finished

HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP

Special Capability

Gold Finger Plating, Peelable, Carbon ink

PCB Assembly Services Introduction:

The creator of PCB is the Austrian Paul Eisler, who first used printed circuit boards in radios in 1936. In 1943, Americans mostly used this technology in military radios, and in 1948, the United States officially recognized this invention for commercial use. Printed circuit boards have only been widely used since the mid-1950s. Printed circuit boards are found in almost every electronic device. If there are electronic parts in a device, they are all mounted on PCBs of various sizes. The main function of the PCB is to make various electronic components form the connection of the predetermined circuit, which plays the role of relay transmission. It is the key electronic interconnection of electronic products and is known as the "mother of electronic products".

Multi Layer PCB Manufacturing Assembly Carbon Ink Nelco Aerospace Pcb Assembly

Product tags

double layer pcb manufacturing

,

fr4 pcb manufacturing process

,

fabrication fr4 pcb
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Multi Layer PCB Manufacturing Assembly Carbon Ink Nelco Aerospace Pcb Assembly

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Product Detail
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
100000pc/Month
Delivery Time :
4 Weeks
Contact Supplier
video
Multi Layer PCB Manufacturing Assembly Carbon Ink Nelco Aerospace Pcb Assembly

TONGZHAN INDUSTRIAL LIMITED

Active Member
3 Years
shenzhen
Since 2011
Business Type :
Manufacturer
Main Products :
Printed Circuit Board Assembly, PCB Board Assembly, PCB Manufacturing
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Active Member
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