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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device
High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device
Specifications
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
100000pc/Month
Delivery Time :
4 Weeks
Packaging Details :
PCB + Box
Brand Name :
CUSTOM MADE
Certification :
ISO/UL
Keyword :
PCB Board Design
Applications :
Automotive Electronics, Communications, Internet, Consumer Electronics, Battery Pack, PCBA Circuit Board
Surface Finished :
HASL Pb Free Immersion Gold/Silver Osp,Immersion Gold+OSP
Copper Thickness :
0.3-12 oz
Min Outline Tolerance :
±0.1mm
Special Capability :
Gold Finger Plating, Carbon ink
Thickness :
0.5-17.5mm
Materials :
High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Payment Method :
T/T
Whether to Support customization :
Support
Logistics :
Accept customer specified logistics
Description

Designability Flexible Boards PCB Board Design Electronics Device High - Tg FR4

Prototype PCB Assembly Description:

1. Focus on component sourcing.
2. Management team with 10+ years of experience in the material.
3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
4. department, Quality department, Customs Declaration department.
5. Professional component validation engineers.
6. Professional BOM Engineers.

Prototype PCB Assembly Parameters:

Item Technical Parameter
Layer 2-64
Thickness 0.3-6.5mm
Copper Thickness 0.3-12 oz
Min Mechanical Hole 0.1mm
Min Laser Hole 0.075mm
HDI 1+n+1,2+n+2,3+n+3
Max Aspect Ratio 20:01
Max Board Size 650mm*1130mm
Min Width/Space 2.4/2.4mil
Min Outline Tolerance ±0.1mm
Impedance Tolerance ±5%
Min PP Thickness 0.06mm
Bow &Twist ≤0.5%
Materials FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
Surface Finished HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
Special Capability Gold Finger Plating, Peelable, Carbon ink

Prototype PCB Assembly Introduction:

The design of the printed circuit board is based on the circuit schematic diagram to realize the functions required by the circuit designer. The design of the printed circuit board mainly refers to the layout design, and the layout of external connections needs to be considered. Various factors such as the optimal layout of internal electronic components, the optimal layout of metal connections and vias, electromagnetic protection, heat dissipation, etc. Excellent layout design can save production costs and achieve good circuit performance and heat dissipation performance. Simple layout design can be realized by hand, and complex layout design needs to be realized by computer-aided design (CAD).High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

Product tags

six layer flexible pcb

,

three layer flexible pcb

,

fr4 flexible rigid multilayer pcb
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High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

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Product Detail
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
100000pc/Month
Delivery Time :
4 Weeks
Contact Supplier
video
High Tg FR4 PCB Board Design Flexible Multi Layer Board Electronics Device

TONGZHAN INDUSTRIAL LIMITED

Active Member
3 Years
shenzhen
Since 2011
Business Type :
Manufacturer
Main Products :
Printed Circuit Board Assembly, PCB Board Assembly, PCB Manufacturing
Total Annual :
5000000-10000000
Employee Number :
50~100
Certification Level :
Active Member
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