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8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask
8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask
Specifications
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0007
Certification :
UL
Place of Origin :
China
MOQ :
1 pcs/lot
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
100k pcs/month
Delivery Time :
20 days
Packaging Details :
Vacuum bubble bag packaging
No of layers: :
8 Layer
Material: :
FR4 TG>180
Solder mask colour: :
Black
Place of Origin: :
ShenZhen China
Surface technics: :
Immersion Gold 2U'
Min Lind Space&Width: :
2.5/2.5mil
Description

HDI PCB High Density Interconnected 8 Layer Black Solder Mask

Main Features:

1 8 Layer HDI PCB, high density printed circuit board.

2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM, L7-L8 0.1MM

3 Buried holes: L4-L7 0.2MM.

4 Via holes: L1-L8 0.2MM.

5 PCB thickness is 1.0mm.

6 Min BGA ball size is 10mil.

7 Min line space and width is 2.5/2.5mil.

8 Material is FR4 Substrate, tg180 degree

9 S1000-2 material used.

S1000-2 Material data sheet:

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC ℃ 180
IPC-TM-650 2.4.24.4 DMA ℃ 185
Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ 7.9 x 107
E-24/125 MΩ 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz -- —
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz -- —
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm —
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

Product tags

hdi printed circuit boards

,

smd led pcb board

,

pcb design handbook
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8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

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Product Detail
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0007
Certification :
UL
Place of Origin :
China
MOQ :
1 pcs/lot
Price :
negotiable
Contact Supplier
8 Laye HDI Printed Circuit Boards High Density PCB Interconnected Black Solder Mask

Witgain Technology Limited

Active Member
4 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Main Products :
Printed Circuit Boards, Multilayer Circuit Board, Half Hole PCB
Total Annual :
25,000,000-30,000,000
Employee Number :
200~300
Certification Level :
Active Member
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