Specifications
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0005
Certification :
UL
Place of Origin :
China
MOQ :
1pcs/lot
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
100kpcs/Month
Delivery Time :
25 days
Packaging Details :
vacuum package in bubble wrap
Layer Count :
10 Layer
PCB Kind :
HDI PCB
Board Thickness :
1.0MM
Min Hole :
0.1MM
Copper Thickness :
1/H/H/H/H/H/H/H/H/1
Surface Treatment :
Immersion Gold 2U'
Material :
IT 180A
BGA Size :
10 MIL
Description

HDI PCB 10 Layer 1.0MM Thickness Immersion Gold 2U' FR4 Substrate

PCB Specifications:

1 Part NO: HDIPCB0005

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.0MM

4 Hole Structure: L1-L2 0.1MM, L2-L3 0.1MM, L3-L4 0.1MM, L4-L5 0.1MM, L5-L6 0.1MM, L6-L7 0.1MM,

L7-L8 0.1MM, L8-L9 0.1MM, L1-L10 0.15MM

5 Min Lind Space&Width: 3/3mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Optical Module

Our production applications:

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

IT180A Data Sheet:

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
8
lb/inch
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1 Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1 >60
20
Minutes Minutes

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1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate

Ask Latest Price
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0005
Certification :
UL
Place of Origin :
China
MOQ :
1pcs/lot
Price :
negotiable
Contact Supplier
1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate
1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate
1.0MM High Density Circuit Board HDI Multilayer Rigid Flex PCB FR4 Substrate

Witgain Technology Limited

Active Member
4 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Total Annual :
25,000,000-30,000,000
Employee Number :
200~300
Certification Level :
Active Member
Contact Supplier
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