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Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Specifications
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0005
Certification :
UL
Place of Origin :
China
MOQ :
1pcs/lot
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
100kpcs/Month
Delivery Time :
15-20 days
Packaging Details :
vacuum package in bubble wrap
Material :
FR4
Layer Count :
8 Layer
Solder Mask :
Black Solder Mask
Board Thickness :
1.2MM
Min Hole :
0.1MM
Min Lind Space and Width :
2.5/2.5MIL
Surface Treatment :
Immersion Gold 2U'
Size :
130mm*60mm
Description

8 Layer HDI PCB FR4 Material Blind And Buried Holes High TG170

  • Main Features:

1 8 Layer HDI PCB with blind and buried holes.

2 Green solder mask and immersion gold treatment.

3 Min hole size is 0.1mm and min BGA size is 9mil.

4 Finished board thickness is 0.8mm.

5 The production cost will be higher than normal multilayer pcb and lead time will also be longer.

6 Need 3 round laminations and 4 round drillings.

7 2+N+2 hole structure: L1-L2 L2-L3 L1-L3 L7-L8 L6-L7 L6-L8 0.1MM, L3-L6 0.2MM, L1-L8 0.2MM.

8 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated.

  • Our Product Categories:

Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
22 Layer immersion gold +OSP
24 Layer Resin filled in vias

  • FAQ:

Q1: What is Surface Mount PCB Assembly?

A1: Surface mount in a PCB assembly means that each component on the PCB is mounted on the surface of the board. In the PCB Assembly process for surface mount components, solder paste is placed on the PCB board at areas where surface mount components will be placed on the board. PCB Stencils are usually used to apply solder paste on the PCB board and a pick and place machine is used to place SMT components on the board.

Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

Surface Mount Assembly is very cost effective, takes up less board space and requires short production times as compared to thru-hole assembly, as it does not require the drilling of holes through the board. However, the component grip is not as good as thru-hole and also the connection can be faulty if not soldered properly.

Product tags

10 layer blind via pcb

,

4 layers pcb technology

,

blind hole pcb
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Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

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Product Detail
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0005
Certification :
UL
Place of Origin :
China
MOQ :
1pcs/lot
Price :
negotiable
Contact Supplier
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material
Blind Buried Holes Rapid Prototyping PCB 8 Layer HDI High TG170 FR4 Material

Witgain Technology Limited

Active Member
4 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Main Products :
Printed Circuit Boards, Multilayer Circuit Board, Half Hole PCB
Total Annual :
25,000,000-30,000,000
Employee Number :
200~300
Certification Level :
Active Member
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