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HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
Specifications
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0009
Certification :
UL
Place of Origin :
China
MOQ :
1 pcs/lot
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
100k pcs/month
Delivery Time :
20 days
Packaging Details :
Vacuum bubble bag packaging
Place of Origin: :
Guangdong China
Material: :
FR4 TG>180
No of layers: :
10 layers
Solder mask colour: :
Green
Surface technics: :
ENIG
Min Lind Space&Width: :
3/3mil
Description

HDI PCB High Density Interconnected Printed Circuit Board With Blind And Buried Holes

  • Main Features:

1 10 Layer HDI PCB, high density printed circuit board.

2 Bline holes: L1-L2 0.1MM, L2-L3 0.1MM, L9-L10 0.1MM, L8-L9 0.1MM

3 Buried holes: L4-L7 0.2MM.

4 Via holes: L1-L10 0.2MM.

5 PCB thickness is 1.0mm.

6 Min BGA ball size is 8mil.

7 Min line space and width is 3/3mil.

8 Material is FR4 Substrate, tg180 degree

9 S1000-2 material used.

  • S1000-2 Material data sheet:

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC ℃ 180
IPC-TM-650 2.4.24.4 DMA ℃ 185
Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ 7.9 x 107
E-24/125 MΩ 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz -- —
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz -- —
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm —
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

  • FAQ:

Q1: What is HDI PCB?

A1: HDI is the abbreviation of high density interconnector. Generally, there are blind and buried holes in HDI PCB. Due to the space limits, some product need to very small size pcb. HDI pcb was generated to save space and increase interconnectors.

Product tags

metireal of pcb

,

blind hole pcb

,

pcb blind via
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HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole

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Product Detail
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0009
Certification :
UL
Place of Origin :
China
MOQ :
1 pcs/lot
Price :
negotiable
Contact Supplier
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole
HDI High Density Interconnected Printed Circuit Board Prototype PCB Blind Buried Hole

Witgain Technology Limited

Active Member
4 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Main Products :
Printed Circuit Boards, Multilayer Circuit Board, Half Hole PCB
Total Annual :
25,000,000-30,000,000
Employee Number :
200~300
Certification Level :
Active Member
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