Multilayer Circuit Board 20 Layer PCB FR4 Material 2.5/2.5Mil Lind Space&Width
PCB Specifications:
1 Part NO: Multi-Layer PCB0024
2 Layer Count: 20 Layer PCB
3 Finished Board Thickness: 2.4MM
4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1
5 Min Lind Space&Width: 2.5/2.5mil
6 Application Area: Consumer Porducts
IR No : QCR Reference : Date: | ||||||
PCB DESCRIPTION | ||||||
C-dot Part Number of PCB | ||||||
Name of the PCB | ||||||
No of Layers : | 20 | Density Classification : E | ||||
PCB Size: | Length | Breadth | Unit | Thickness | ||
280 | X | 322.25 | mm | 2.4 mm | ||
Panel Size: | 290 X 322.25 mm 2.4 mm | |||||
Number of PCBs per Panel : | 1 | |||||
DESIGN & DRILL DATA | ||||||
Input type : | Gerber Files | Qty 27 | ||||
Input Code : | ASCII | |||||
Number Format : | 2.4 | |||||
Units : | Inches | |||||
Zero Omit : | Trailing | |||||
Coordinates: | Absolute | |||||
Scale : | 1:1 | |||||
DRC CHECKS FOR SIGNAL LAYERS | ||||||
Minimum Track width : | Inner Layer 3.75 mils | Outer Layer 5 mils | ||||
Minimum Spacing between Tracks : | Inner Layer 5 mils | Outer Layer 5 mils | ||||
Minimum Spacing between Pad & Track: | Inner Layer 4 mils | Outer Layer 5 mils | ||||
Minimum PTH Size: | 10 mils | |||||
Minimum Annular Ring: | 4 mils | |||||
Minimum SMD Pitch: | 19.685 mils | |||||
FILM & GERBER DETAILS | ||||||
Description | Films | File Name | Description | Films | File Name | |
Drill | DRL | ABC00DRL.GBX | Etch Layer 17 | L17 | ABC00L17.GBX | |
Solder Paste Top | SPT | ABC00SPT.GBX | Etch Layer 18 | L18 | ABC00L18.GBX | |
Legend Top | LGT | ABC00LGT.GBX | Etch Layer 19 | L19 | ABC00L19.GBX | |
Solder Mask Top | SMT | ABC00SMT.GBX | Etch Layer 20 | L20 | ABC00L20.GBX | |
Etch Layer 1 | L01 | ABC00L01.GBX | Etch Layer 21 | L21.GBX | ||
Etch Layer 2 | L02 | ABC00L02.GBX | Etch Layer 22 | L22.GBX | ||
Etch Layer 3 | L03 | ABC00L03.GBX | Etch Layer 23 | L23.GBX | ||
Etch Layer 4 | L04 | ABC00L04.GBX | Etch Layer 24 | L24.GBX | ||
Etch Layer 5 | L05 | ABC00L05.GBX | Etch Layer 25 | L25.GBX | ||
Etch Layer 6 | L06 | ABC00L06.GBX | Etch Layer 26 | L26.GBX | ||
Etch Layer 7 | L07 | ABC00L07.GBX | Etch Layer 27 | L27.GBX | ||
Etch Layer 8 | L08 | ABC00L08.GBX | Etch Layer 28 | L28.GBX | ||
Etch Layer 9 | L09 | ABC00L09.GBX | Etch Layer 29 | L29.GBX | ||
Etch Layer 10 | L10 | ABC00L10.GBX | Etch Layer 30 | L30.GBX | ||
Etch Layer 11 | L11 | ABC00L11.GBX | Solder Mask Bottom | SMB | ABC00SMB.GBX | |
Etch Layer 12 | L12 | ABC00L12.GBX | Legend Bottom | LGB | ABC00LGB.GBX | |
Etch Layer 13 | L13 | ABC00L13.GBX | Solder Paste Bottom | SPB | ABC00SPB.GBX | |
Etch Layer 14 | L14 | ABC00L14.GBX | NC Drill | NCD | ABC00_NCD.TAP | |
Etch Layer 15 | L15 | ABC00L15.GBX | NC Drill Tool Set | NCT | ABC00NCT.TXT | |
Etch Layer 16 | L16 | ABC00L16.GBX | Decode List | DCL.TXT |
MANUFACTURING DETAILS | |
Solder Mask Type : | Photo Imageable |
Minimum Solder Mask Clearance : | 2.5 mils |
Legend On (Side) : | Both |
Design Technology | Mixed |
Special Requirements : | |
Controlled Impedance : Yes Back dril from Bottom : 7 Layers / Files Back drill pin count : 156 pins |
|
BGA Used | |
Base Material | FR408HR |
If base material is other than FR4 please provide complete details of the material: |
|
Surface Finish | Electroless gold over nickel (ENIG) |
Gold Plating required for Edge fingers No of Edge Fingers/Total Area (Specify , if the option is 'yes') |
No |
Nos/ Sq Inches | |
Automatic Copper Balancing Allowed | Yes |
Tear Drop | Triangular to be added by the fabricator |
Constructional Details Drawing No | Layer stackup |
MISCELLANEOUS DETAILS | |
The PCB 1. Has vias on pads filled with epoxy and plated with planner.2. Has back-drill vias filled with epoxy 3. Has ENIG surface finish. 4. Five Back drill NCD files attached 5. Depanalizing pcb by slot cut. Back drill layers: 1.Bottom to Layer19, 2.Bottom to Layer17, 3.Bottom to Layer15, 4.Bottom to Layer10, 5.Bottom to Layer08, 6.Bottom to Layer06, 7.Bottom to Layer04. |
|
APPROVALS | |
Designer Name | Approved by |
Layer Stackup:
Layer No. | Layer Type | Di-electric (Prepreg/ Core) |
Di-electric constant |
Processed Thickness (mil) |
Target Impedance - Single Ended (+/- 10%) |
Trace Width (Single ended) (mil) |
Target Impedance – differential (+/- 10%) |
Trace Width/ separation (differential pair) (mil) |
MASK | 4.0 | 2.0 | ||||||
1 | TOP |
Copper Foil 12 microns
|
1.772 |
50 ohm 55 ohm |
7 6 |
100ohm 95ohm 90ohm |
5-8-5 5-6.5-5 5-5.5-5 |
|
PrepreG | 3.23 | 2.101 | ||||||
PrepreG | 3.23 | 2.101 | ||||||
2 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
3 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
4 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
5 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
6 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
7 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
8 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
9 | POWER | Copper | 2.638 | |||||
PrepreG | 3.23 | 0.788 | ||||||
PrepreG | 3.23 | 0.788 | ||||||
10 | GND | Copper | 2.638 | |||||
core | 3.37 | 3.9 | ||||||
11 | POWER | Copper | 2.638 | |||||
PrepreG | 3.23 | 0.788 | ||||||
PrepreG | 3.23 | 0.788 | ||||||
12 | POWER | Copper | 2.638 | |||||
core | 3.37 | 3.9 | ||||||
13 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
14 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
CORE | 3.37 | 3.9 | ||||||
15 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
16 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
CORE | 3.37 | 3.9 | ||||||
17 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
18 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
CORE | 3.37 | 3.9 | ||||||
19 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 2.101 | ||||||
PrepreG | 3.23 | 2.101 | ||||||
20 | SOLDER |
Copper Foil 12 microns
|
1.772 |
50 ohm 55 ohm |
7 6 |
100ohm 95ohm 90ohm |
5-8-5 5-6.5-5 5-5.5-5 |
|
MASK | 2.0 |