HDI PCB 6 Layer Blue Solder Mask Immersion Gold Treatment 1.0 MM Thickness
PCB Specifications:
1 Part NO: HDIPCB0008
2 Layer Count: 6 Layer HDI PCB
3 Finished Board Thickness: 1.0MM
4 Drilling: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM
5 Min Lind Space&Width: 2.8/3.6mil
6 Copper Thickness: 1/1/1/1/1/1
7 Application Area: Consumder Electronics
8 PCB Size: 140.86MM*108.71MM/2PCS
Our production applications:
1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.
2 Industrial control:main boards in machines, industrial robots, servo motors etc.
3 Automotive: BMS main boards, automotive radar etc.
4 Power supplies: UPS, industrial power supply, frequency power supply.
5 Medical: medical equipment, medical equipment power supply.
6 Communication products: 5G base station, routers, satellites, antennas.
Our Product Categories:
Our Product Categories | ||
Material Kinds | Layer Counts | Treatments |
FR4 | Single Layer | HASL Lead Free |
CEM-1 | 2 Layer/Double Layer | OSP |
CEM-3 | 4 Layer | Immersion Gold/ENIG |
Aluminum Substrate | 6 Layer | Hard Gold Plating |
Iron Substrate | 8 Layer | Immersion Silver |
PTFE | 10 Layer | Immersion Tin |
PI Polymide | 12 Layer | Gold fingers |
AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
Halogen free | 18 Layer | HDI Laser drilling |
Copper based | 20 Layer | Selective immersion gold |
22 Layer | immersion gold +OSP | |
24 Layer | Resin filled in vias |