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16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
Specifications
Brand Name :
WITGAIN PCB
Model Number :
Multi-Layer PCB0025
Certification :
UL
Place of Origin :
China
MOQ :
1 pcs/lot
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
20k pcs/month
Delivery Time :
30 days
Packaging Details :
Vacuum bubble bag packaging
No of layers: :
16 layers
Silkscreen :
White
PTH Wall Copper :
25 UM
Finished Thickness :
2.0 MM
Surface technics: :
ENIG 2U'
Min Lind Space&Width: :
3/3 mil
Description

Multilayer Circuit Board 16 Layer PCB 2.0 MM Thickness

PCB Specifications:

1 Part NO: Multi-Layer PCB0025

2 Layer Count: 16 Layer PCB

3 Finished Board Thickness: 2.0MM

4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1

5 Min Lind Space&Width: 3/3mil

6 Application Area: Industrial Control


Material Data Sheet:

S1130
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC ℃ 135
Td IPC-TM-650 2.4.24.6 5% wt. loss ℃ 310
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 65
After Tg ppm/℃ 310
50-260℃ % 4.5
T260 IPC-TM-650 2.4.24.1 TMA min 13
T288 IPC-TM-650 2.4.24.1 TMA min <1
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 60S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 4.8E + 08
E-24/125 MΩ.cm 4.6E + 06
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ 5.2E + 07
E-24/125 MΩ 5.3E + 06
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 120
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 60
Electrical Strength IPC-TM-650 2.5.6.2 D-48/50+D-4/23 kV/mm —
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.6
IEC 61189-2-721 10GHz -- —
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.016
IEC 61189-2-721 10GHz -- —
Peel Strength(1oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm —
After thermal Stress 288℃,10s N/mm 1.8
125℃ N/mm 1.6
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 600
CW IPC-TM-650 2.4.4 A MPa 500
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.15
CTI IEC30112 C-48/23/50, ℃ PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Layer Stackup:

Layer No. Layer Type Di-electric (Prepreg/ Core)

Di-electric

constant

Processed Thickness

(mil)

Target Impedance - Single Ended

(+/- 10%)

Trace Width (Single ended)

(mil)

Target Impedance – differential

(+/- 10%)

Trace Width/ separation (differential pair)

(mil)
MASK 4.0 2.0
1 TOP

Copper Foil 12 microns

 1.772

50 ohm

55 ohm

7

6

100ohm

95ohm

90ohm

5-8-5

5-6.5-5

5-5.5-5
PrepreG 3.23 2.101
PrepreG 3.23 2.101
2 GND Copper 0.689
CORE 3.37 3.9
3 SIGNAL Copper 0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4
PrepreG 3.23 1.86
PrepreG 3.23 1.86
4 GND Copper 0.689
CORE 3.37 3.9
5 SIGNAL Copper 0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4
PrepreG 3.23 1.86
PrepreG 3.23 1.86
6 GND Copper 0.689
CORE 3.37 3.9
7 SIGNAL Copper 0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4
PrepreG 3.23 1.86
PrepreG 3.23 1.86
8 GND Copper 0.689
CORE 3.37 3.9
9 POWER Copper 2.638
PrepreG 3.23 0.788
PrepreG 3.23 0.788
10 GND Copper 2.638
core 3.37 3.9
11 POWER Copper 2.638
PrepreG 3.23 0.788
PrepreG 3.23 0.788
12 POWER Copper 2.638
core 3.37 3.9
13 GND Copper 0.689
PrepreG 3.23 1.86
PrepreG 3.23 1.86
14 SIGNAL Copper 0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4
CORE 3.37 3.9
15 GND Copper 0.689
PrepreG 3.23 1.86
PrepreG 3.23 1.86
16 SIGNAL Copper 0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4
CORE 3.37 3.9
17 GND Copper 0.689
PrepreG 3.23 1.86
PrepreG 3.23 1.86
18 SIGNAL Copper 0.689

50 ohm

55 ohm

4

3.75

100ohm

95ohm

90ohm

4-7-4

4-6-4

4-4.5-4
CORE 3.37 3.9
19 GND Copper 0.689
PrepreG 3.23 2.101
PrepreG 3.23 2.101
20 SOLDER

Copper Foil 12 microns

 1.772

50 ohm

55 ohm

7

6

100ohm

95ohm

90ohm

5-8-5

5-6.5-5

5-5.5-5
MASK 2.0

Product tags

1.6mm thick 4 layer pcb

,

0.6 mm thickness multilayer pcbs

,

4 layer 1.6mm thick pcb
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16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness

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Product Detail
Brand Name :
WITGAIN PCB
Model Number :
Multi-Layer PCB0025
Certification :
UL
Place of Origin :
China
MOQ :
1 pcs/lot
Price :
negotiable
Contact Supplier
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness
16 Layer PCB Multilayer Circuit Board 2.0 MM Thickness

Witgain Technology Limited

Active Member
4 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Main Products :
Printed Circuit Boards, Multilayer Circuit Board, Half Hole PCB
Total Annual :
25,000,000-30,000,000
Employee Number :
200~300
Certification Level :
Active Member
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