4 Layer Half Hole PCB TG150 Material 1.0 MM Thickness

Board Info:

1 Part NO: Half hole PCB0019

2 Layer Count: 4 Layer PCB

3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM

4 Solder Mask: Green Solder Mask

5 Min Lind Space&Width: 4/4 mil

6 Application Area: Blue-tooth Module

7 Drillings: L1-L2 0.1MM, L2-L3 0.15MM, L3-L4 0.1MM, L1-L4 0.2MM Mechanical Drilling

8 PCB Size: 105.95mm*83mm/30pcs

9 Material: S1150G

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

X-OUT per panel:

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

Requirement:

1 All dimensions are in MM.

2 Fabricate per IPC-6012A Class2.

3 Materials:

3.1 Dielectric: FR4 Per IPC or equivalent

3.2 Min Tg: 170DEG

3.3 Copper: As per stack up

3.4 UL Rating: 94V0 Minimum

4 Surface finish: ENIG

5 Solder mask material should meet all requirement of the IPC-SM-840E and shall be green in color and applied over bare copper. Vendor may edit solder mask and paste mask as needed.

6 Editing of existing copper layers shall require customer approval.

7 Silkscreen legend to be applied per layer stackup using white non-conductitive epoxy ink.

8 100% continuity testing using database netlist shall be performed.Vendor to identify test passed in secondary side.

9 Vendor to mark date code and logo in legend secondary side.

10 Bow and twist shall not exceed 1.0% of longest side.

11 Vendor to provide panel drawing for customer approval before production