Specifications
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0013
Certification :
UL
Place of Origin :
China
MOQ :
1pcs/lot
Price :
negotiable
Payment Terms :
T/T
Supply Ability :
100kpcs/Month
Delivery Time :
25 days
Packaging Details :
vacuum package in bubble wrap
Layer Count :
4 Layer
PCB Kind :
HDI PCB
Board Thickness :
1.6MM
Min Hole :
0.1MM
Copper Thickness :
1/1/1/1 OZ
Surface Treatment :
Immersion Gold 1U'
Material :
S1150G
PCB Size :
110mm*100mm/6pcs
Description

HDI PCB 4 Layer Blind And Buried Holes 1.6 MM Thickness TG 150 Material

PCB Specifications:

1 Part NO: HDIPCB0013

2 Layer Count: 4 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Drilling: L1-L2 0.15MM, L1-L4 0.2MM

5 Min Lind Space&Width: 6/6mil

6 Copper Thickness: 1/1/1/1 OZ

7 Application Area: Consumer Products

8 File Format: Gerber File

9 PCB Size: 110mm*100mm/6pcs

10 Other Requirements: 0.2MM Holes on BGA PAD, Need to do epoxy filled in vias

Our production applications:

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

IT180A Data Sheet:

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum
A. Low profile copper foil
B. Standard profile copper foil
2.4.8 5
8
lb/inch
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.10 %
Permittivity (Dk, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
4.5
4.4
--
Loss Tangent (Df, 50% resin content)
A. 1MHz
B. 1GHz
2.5.5.9
2.5.5.9
0.014
0.015
--
Flexural Strength, minimum
A. Length direction
B. Cross direction
2.4.4 500-530
410-440
N/mm2
Thermal Stress 10 s at 288°C
A. Unetched
B. Etched
2.4.13.1 Pass Pass Rating
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1
B. Alpha 2
C. 50 to 260 Degrees C
2.4.24 45
210
2.7
ppm/˚C ppm/˚C
%
Thermal Resistance
A. T260
B. T288
2.4.24.1 >60
20
Minutes Minutes

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4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material

Ask Latest Price
Brand Name :
WITGAIN PCB
Model Number :
HDIPCB0013
Certification :
UL
Place of Origin :
China
MOQ :
1pcs/lot
Price :
negotiable
Contact Supplier
4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material
4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material
4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material
4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material
4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material
4 Layer HDI PCB Blind Buried Holes 1.6 MM Thickness TG 150 Material

Witgain Technology Limited

Active Member
4 Years
shenzhen
Since 2007
Business Type :
Manufacturer
Total Annual :
25,000,000-30,000,000
Employee Number :
200~300
Certification Level :
Active Member
Contact Supplier
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