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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Specifications
Brand Name :
WANLI-ADHESION
Model Number :
EVA-JF-108
Certification :
ISO9001 ISO14001 IATF16949
Place of Origin :
CHINA
MOQ :
25 KG
Payment Terms :
L/C, T/T
Delivery Time :
5-8 work days
Packaging Details :
25Kg/Bag
Product :
EVA Hot Melt Adhesive
Component :
EVA
Appearance :
White Solid Particles
Solid Content :
100 Percent
Shelf Life :
2 * Years
Melt Viscosity :
70000±10000mpa·s (200℃)
Softening Temperature :
95℃~105℃
Operating Temperature :
180℃～200℃
Usage Scope :
Edge Bonding of Wood Materials- Chip Board
Application Industry :
Woodworking Edgebanding
Description

Hot Sale Factory Direct 100% Solid White Round Particles EVA Hot Melt Adhesive WANLI® EVA-JF-108 for Edge Bonding with High Bonding Strength

Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for bonding of chip board to various kinds of edge band. It is featured high bonding strength, lower cost and fast curing.

APPLICATION

Wanli® EVA hot melt adhesive JF-108 is used for bonding of chip board to various kinds of edge band.

Application Material Woodworking Edgebanding Hot Melt Adhesives
Appearance White Solid Particles
Component EVA
Application Industry Woodworking Edgebanding
Solid Content 100%
Operating Temperature 180℃～200℃( Depend On Machine, Substrate, Environment And Other Conditions).
Softening Temperature 95℃~105℃
Melt Viscosity 70000±10000mpa·s (200℃)
Curing Normal Temperature Curing
Usage Scope Edge Bonding of Wood Materials- Chip Board
Shelf Life 2 * Years
Package 25Kg/Bag

FEATURE

High bonding strength, lower cost and fast curing

USER GUIDE

The package of JF-108 is suitable for various dispensing equipment. The recommended operating temperature is 180℃~200℃, which depends on the equipment, substrate and environment and other conditions.

STORAGE

Store indoors and do not expose to extreme weather conditions (e.g. rain or exposure to sunlight). The storage temperature should be no more than 35℃ and avoid open fire or heat source.

Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108 Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

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Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

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Product Detail
Brand Name :
WANLI-ADHESION
Model Number :
EVA-JF-108
Certification :
ISO9001 ISO14001 IATF16949
Place of Origin :
CHINA
MOQ :
25 KG
Payment Terms :
L/C, T/T
Contact Supplier
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108
Edgebanding Woodworking Hot Melt Adhesive Chip Board Edge Bonding EVA-JF-108

WUXI WANLI ADHESION MATERIALS CO., LTD.

Verified Supplier
3 Years
jiangsu, wuxi
Since 1995
Business Type :
Manufacturer
Main Products :
PUR Hot Melt Adhesives, Hot Melt Pressure Sensitive Adhesives, EVA Hot Melt Adhesives
Employee Number :
100~500
Certification Level :
Verified Supplier
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