Specifications
Brand Name :
WANLI-ADHESION
Model Number :
PUR-XBB768
Certification :
ISO9001 ISO14001 IATF16949
Place of Origin :
CHINA
MOQ :
20 KG
Payment Terms :
L/C, T/T
Delivery Time :
5-8 work days
Packaging Details :
2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel
Product :
PUR Hot Melt Adhesive
Component :
PUR (Polyurethane)
Appearance :
Ivory White Solid
Solid Content :
100%
Shelf Life :
6 Months
Melt Viscosity :
About 55000mPa·s@120℃
Operating Temperature :
120~140 ℃
Open Time :
8~15s@25℃
Useage Scope :
Edge Bonding of Wood Materials- Chip Board
Application Industry :
Woodworking Edgebanding
Description

Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufacture.


Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates. PUR-XBB768 is featured good initial adhesion, suitable opening time, high bonding strength.

APPLICATION
Wanli® PUR hot melt adhesive PUR-XBB768 is used for edge bonding. PUR-XBB768 is mainly used for edge bonding of wood materials, foam boards, and some aluminum substrates.

Application Material Woodworking Edgebanding Hot Melt Adhesives
Appearance Ivory White Solid
Component PUR (Polyurethane)
Application Industry Woodworking Edgebanding
Solid Content 100%
Operating Temperature 120~140 ℃( Depend On Machine, Substrate, Environment And Other Conditions)
Melt Viscosity About 55000mPa·s@120℃(Brookfield-ASTMD3236)
Open Time 8~15s@25℃
Usage Scope Edge Bonding of Wood Materials - Chip Board
Shelf Life 6 Months
Package 2Kg/Bag, 18Kg/Barrel, 20Kg/Barrel, 200Kg/Barrel


FEATURE
Very good initial adhesion.
Suitable opening time.
High final bonding strength.

USER GUIDE
The package of PUR-XBB768 is suitable for various dispensing equipment.
The recommended operating temperature is 120℃~140℃.
It is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 55% relative humidity) to achieve complete curing.

STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768 Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

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Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

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Brand Name :
WANLI-ADHESION
Model Number :
PUR-XBB768
Certification :
ISO9001 ISO14001 IATF16949
Place of Origin :
CHINA
MOQ :
20 KG
Payment Terms :
L/C, T/T
Contact Supplier
video
Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

WUXI WANLI ADHESION MATERIALS CO., LTD.

Verified Supplier
3 Years
jiangsu, wuxi
Since 1995
Business Type :
Manufacturer
Employee Number :
100~500
Certification Level :
Verified Supplier
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