Hot Sale Factory Direct Bulk Light Yellow Chips EVA Hotmelt WANLI® C-21 with Viscosity 4800±800mpa·s (130℃) for Book Cover Bonding at Paper Weight ≤200G/m²
Wanli® EVA hotmelt adhesive C-21 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-21 is specifically developed for book wireless binding. C-21 is featured high bonding strength, fast curing, suitable for automatic hotmelt glue binding book production line.
APPLICATION
Wanli® EVA hotmelt adhesive C-21 is used for book cover wireless bonding. C-21 is suitable for paper with a weight of ≤200G/m².
Application Material | Book Cover Binding Hot Melt Adhesives |
Appearance | Light Yellow Chips |
Component | EVA |
Application Industry | Hot Melt Adhesives for Book Cover Binding |
Solid Content | 100% |
Operating Temperature | 130~150 ℃( Depend On Substrate, Environment, Equipment And Other Conditions) |
Softening Temperature | 72±5 ℃ |
Melt Viscosity | 4800±800mpa·s (130℃) |
Usage Scope | For Paper With A Weight Of ≤200G/m² |
Shelf Life | 2 Years |
Package | 25Kg/Bag |
FEATURE
Fast curing.
Low cost.
Good bonding strength.
Suitable for automatic hot melt glue binding book production line.
USER GUIDE
The package of C-21 is suitable for various dispensing equipment.
The recommended operating temperature is 130~150℃, which depends on the equipment, substrate and environment and other conditions.
STORAGE
Dry, cool, avoid direct sunlight, no more than 35℃.