High Performance Electronic Components Bonding Hot Melt Adhesives PUR-8854

Wanli® hot melt adhesive PUR-8854 for electronic component bonding is a one-component reactive PUR hot melt adhesive with 100% solids content. PUR-8854 can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8854 is characterized by stable viscosity when heated at a certain temperature and high initial and final bonding strength. After curing, PUR-8854 has nice peeling strength, heat&humidity resistance and chemical resistance. PUR-8854 is especially suitable for bonding applications in the electronic industry and detachable under high temperature.

APPLICATION

Wanli® PUR hot melt adhesive PUR-8854 is used for electronics components bonding. PUR-8854 can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8854 is especially suitable for bonding applications in the electronic industry and detachable under high temperature.

FEATURE

Stable viscosity under heating at a certain temperature.

High initial bonding strength and final bonding strength.

PUR-8854 has good peeling strength, good heat & humidity resistance and chemical resistance after curing.

USER GUIDE

The package of PUR-8854 is suitable for various dispensing equipment.

The recommended operating temperature is about 110℃.

In order to achieve complete curing, it is better to place finished product in suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.