Factory Supply Hot Melt Adhesives PUR-8854H for Electronic Components Bonding

Wanli® hot melt adhesive PUR-8854H for electronics components bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8854H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless-steel and others. PUR-8854H has stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, PUR-8854H has good peeling strength/ heat & humidity resistance and chemical resistance. PUR-8854H is awesomely suitable for bonding applications in the electronic industry.

APPLICATION
Wanli® PUR hot melt adhesive PUR-8854H is used for electronics components bonding. PUR-8854H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8854H is especially suitable for bonding applications in the electronic industry.

FEATURE
Stable viscosity under heating at a certain temperature.
High initial bonding strength and final bonding strength.
It has good peeling strength, good heat & humidity resistance and chemical resistance after curing.

USER GUIDE
The package of PUR-8854H is suitable for various dispensing equipment.
The recommended operating temperature is about 110℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, recommended relative humidity: about 65%).

STORAGE
Store where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.