Product Description: Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key ...learn more
Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768

Chip Edgebanding Low Temperature Hot Melt Glue White Polypropylene PUR-XBB768
5-8 work days
ISO9001 ISO14001 IATF16949
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WUXI WANLI ADHESION MATERIALS CO., LTD.

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