Rigid-Flex PCB High Tg Fr-4+Pi Eing rigid flexible pcb, rigid flex circuits
One of the PCB assembly magnate, IBE adopts advanced production techniques and manufacturing practices with specialization in a varied range of PCB fabrication process, producing high quality multi-layered PCBs from tailor-made layouts.
With over 20 years of combined experience in rendering high tech PCB assembly and manufacturing services, we are not just an assembler, we can completely test at board level to box build level to provide the benefit of unparalleled technical expertise and the most progressive solutions at competitive prices.
PCBA Capability
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
be cut and delivered inside of 4 hours.
PCB Manufacturing Capability | |
PCB Layers: | 1Layers to 18 layer (Max) |
Board thickness: | 0.13~6.0mm |
Min line width/space: | 3mil |
Min mechanical hole size: | 4mil |
Copper thickness: | 9um~210um(0.25oz~6oz) |
Max aspect ratio: | 1:10 |
Max board size: | 400*700mm |
Surface Finish: | HASL, immersion gold, immersion silver,immersion tin, flash gold, gold finger,peelable mask |
Material: | FR4,High Tg, Rogers, CEM-1, CEM-3, Aluminum BT, PTFE. |
Min Chip Size: | 01005 |
Max BGA Size: | 74*74mm |
BGA Ball Pitch: | 1.00~3.00mm |
BGA Ball Diameter: | 0.4~1.0mm |
QFP Lead Pitch: | 0.38~2.54mm |
Testing : | ICT,AOI,X-RAY,Funtional test etc. |
Order Conditions | Standard Delivery Date | The fastest Delivery Date |
Prototype ( <20pcs) | 2days | 8hours |
Small Volume (20-100pcs) | 6days | 12hours |
Medium Volume (100-1000) | 3days | 24hours |
Mass Production (>1000) | Depends on BOM | Depends on BOM |
FAQ:
1.How does a printed circuit board assembly (PCB assembly) work?
The primary function of a PCB assembly is to integrate the electronic components of a device into a compact or defined space. Acting as the central hub of the electronic circuit of a device, the PCB provides insulation for all other electrical components, allowing them to be safely connected to a power source.
For turnkey projects, we’ll need the following:
Gerber file
Bill of materials (BOM)
Component placement list (CPL)
All relevant CAD and .stp file
IBE pursues all applicable UL certifications for our products, and we offer several products certified with UL and CSA based on customer’s demand
Underwriters Laboratories (UL) grants multiple certifications, including:
IBE is certified for PCB by UL file E326838
5. Do you offer testing and inspection services?
Yes, IBE offers a comprehensive list of testing and inspection services for both SMT and through-hole assemblies.
Visual inspection/scanning microscopes
AOI inspection
In-circuit test
Functional testing include automated test equipment and system
Burn-in tests
Low/High Temp Chamber Testing
X-ray inspection and repair
Salt fog tester
Drop Test
packing vibration
Conformal coating and potting