China's Largest PCB Prototype Manufacturer, offers 24 hours Quick Turn PCB prototype, SMT assembly
With more than 500 experienced workers and technical team, IBE can offer 15,000 square meters per month. Plant covering 200,000 square meters with the imported and maximum precision facilities, manufacturing lines are totally automation, Meanwhile, you can be sure of quality with our ISO 9001:2008, UL, ISO14001, ROHS and TS16949 approval.Our products include 1-10 layers of simple to high density boards;flex circuits and rigid flex boards, which are the substrate of consumer electronic merchandize, communication device, industrial automation machine, IT product, medical equipment and automotive electronics etc.We handle all types of pcb assembly, from basic through hole PCB assembly to standard surface mount PCB assembly to ultra-fine pitch BGA assembly. Our engineers work with customers from across all fields including telecommunications, aviation, consumer electronics, wireless, medial, automotive and instrumentation.
Our Advantages:
1, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam.
2, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test
3, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
4, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
7 | PCBA QC | X-ray,AOI Test,Functional Test |
8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |