Soi Wafer Silicon on Insulator Semiconductor Wafer
SOI Wafer (Silicon On Insulator)
* SOI Wafer sizes from 3" to 200mm, some in inventory
* Very high quality with tight TTV on device layer thickness
* Direct Si-Si bonding and double sided SOI available
* Any Si orientation, any device thickness over 1.5um
* Single and double side polished
* Small lot sizes and Laser marking of wafers available
* Short lead time delivery
TYPES OF SOI WAFER
Customizability is a major cornerstone of We and we always try our best to meet all your needs. In that very essence
We offers SOI wafers of the following types:
Thick SOI Wafer
This type of wafer has device thickness from 1µm to 300µm.
Ultra-Thin SOI Wafer
This type of wafer has device thickness <500nm.
Ultra-Uniform SOI Wafer
Uniformity of device thickness can be as low as ±0.5µm for thick SOI and ±10nm for ultra-thin SOI.
Ultra-Flat SOI Wafer
This type of SOI has very low BOW/WARP/TTV for specific applications.
SOI wafers are offered with great customizability and the parameters are greatly flexible as per your needs.
Product Picture
Package