Centerless Grinding Wheels Resin Bond Diamond For Tungsten Carbide
Shine Abrasives Resin Bond Diamond Centerless Grinding Wheel is used for grinding carbide, ceramics,
magnetic material, stainless steel bar.
Suit for grinding machine like Brand Koyo, Crystec, Dedtru, Landis , Okuma, Paragon, Royal Master, Unison, WMV.
Main sizes form of Shine Abrasives Centerless Grinding Wheels Resin Bond Diamond For Tungsten Carbide
Abrasive Material:Diamond | Bond Type:Resin |
Diamond Grit:D107 | Wheel Diameter: 350mm |
Wheel Bore:127mm | Wheel Weight:20kgs/PC |
Wheel Thickness:50mm | Concentrate: 100% |
Other standard sizes also are available as requested.
Features of Shine Abrasives Centerless Grinding Wheels Resin Bond Diamond For Tungsten Carbide
Free cutting, good grinding speed.
Low working cost.
Long time wheel life.
Good surface finish after fine grinding
Application picture for reference.