Today, we will explore the world of RO3206 high-frequency circuits, which are laminates infused with ceramic and reinforced with woven fiberglass.

These specially engineered materials offer exceptional electrical performance and mechanical stability at competitive prices. One key characteristic that sets RO3206 high-frequency materials apart is their enhanced mechanical stability.

RO3206 laminates combine the advantages of non-woven PTFE laminates, such as a smooth surface for finer line etching tolerances, with the strength and rigidity of woven-glass PTFE laminates. With these materials, printed circuit boards can be fabricated using standard PTFE circuit board processing techniques.

Manufactured under an ISO 9002 certified quality system, RO3206 laminates possess impressive properties. Let's delve deeper into their notable characteristics.

RO3206 Typical Properties

The dielectric constant is a crucial property of this material. At a frequency of 10 GHz and a temperature of 23°C, the process dielectric constant in the Z direction is 6.15 ± 0.15, as measured by the IPC-TM-650 2.5.5.5 Clamped Stripline test method. For design purposes in the frequency range of 8 GHz to 40 GHz, the dielectric constant in the Z direction is 6.6, measured using the Differential Phase Length Method.

Another important property is the dissipation factor. At a frequency of 10 GHz and a temperature of 23°C, the Df value in the Z direction is 0.0027, as measured by the IPC-TM-650 2.5.5.5 test method.

In terms of dimensional stability, this material performs well. In the X and Y directions, the dimensional stability is 0.8 mm/m, measured using COND A of the ASTM D257 test method.

RO3206 also exhibits excellent electrical properties. The volume resistivity is 10^3 MΩ•cm, and the surface resistivity is 10^3 MΩ, both measured using COND A of the IPC 2.5.17.1 test method.

With a tensile modulus of 462 kpsi in both the MD and CMD directions, as tested at 23°C using the ASTM D638 test method, RO3206 demonstrates good mechanical strength.

Water absorption is minimal, measuring less than 0.1% based on the D24/23 test method of the IPC-TM-650 2.6.2.1 standard.

The specific heat of RO3206 is calculated to be 0.85 J/g/K based on its chemical composition.

In terms of thermal conductivity, the material exhibits a value of 0.67 W/m/K at a temperature of 80°C, as measured by the ASTM C518 test method.

The coefficient of thermal expansion is 13, 13, and 34 ppm/°C in the X, Y, and Z directions, respectively. These measurements were obtained at a temperature of 23°C and 50% relative humidity using the IPC-TM-650 2.4.41 test method.

The Td (thermal decomposition temperature) of RO3206 is 500°C, determined using the TGA test method according to ASTM D3850.

The material has a density of 2.7 g/cm3 and exhibits a tan color.

When it comes to copper peel strength, RO3206 achieves a value of 10.7 pli when tested using 1 oz. ED copper after solder float, following the IPC-TM-2.4.8 test method.

Furthermore, the material is lead-free process compatible and has received a V-0 flammability rating according to UL 94.

Our PCB Capability (RO3206)

We offer a wide range of PCB options for RO3206, including single-sided, double-sided, multilayer, and hybrid boards.

You can choose from copper weights of 1oz (35µm) and 2oz (70µm), as well as dielectric thicknesses of 25mil (0.635mm) and 50mil (1.27mm).

PCB sizes can reach up to 400mm x 500mm, either as single boards or multiple types in a panel.

We provide various solder mask options, including green, black, blue, yellow, and red.

When it comes to surface finish, we offer immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold plated finishes.

Conclusion:

In conclusion, RO3206 high-frequency circuits provide a dependable solution for a wide range of applications, thanks to their remarkable electrical performance and mechanical stability. Whether used in automotive collision avoidance systems or telecommunications equipment, RO3206 laminates offer excellent properties that meet the demanding requirements of high-frequency circuits.