Today, we will be discussing TLY-5Z PCBs, a type of high frequency PCB that is manufactured on lightweight substrates.

TLY-5Z laminates are advanced composites made of glass-filled PTFE, reinforced with woven fiberglass. These laminates were specifically developed for low density applications with weight constraints, such as aerospace.

The glass-filled structure provides dimensional stability that cannot be achieved with non-reinforced PTFEs. It also results in a composite with a low Z axis expansion, which is not attainable with PTFE-rich composites.

Now, let's take a closer look at the typical properties of TLY-5Z laminates.

TLY-5Z exhibits a low dielectric constant of 2.2 and a low dissipation factor of 0.0015 at 10 GHz. It also has good volume resistivity of 10^9 Mohms/cm and surface resistivity of 10^8 Mohms.

In terms of electrical performance, TLY-5Z boasts a high dielectric breakdown voltage of 45 kV and a dielectric strength of 770 V/mil.

Compared to conventional materials with a 2.2 dielectric constant, TLY-5Z has a lower temperature coefficient of dielectric constant (TCDk) of -72 ppm/°C, ranging from -55 to 150°C. However, its thermal conductivity is relatively low at 0.2 W/m/K.

On the other hand, TLY-5Z has excellent mechanical properties. It exhibits a peel strength of 7 lbs./inch for 1 oz copper and a tensile strength of over 9000 psi in both the machine direction (MD) and cross direction (CD). The tensile modulus exceeds 16000 psi in both directions, and it can elongate extension by 6% and 6.9%.

In terms of flexural strength, TLY-5Z performs well with 10300 psi and 11600 psi in the MD and CD directions respectively. Additionally, it has a high flexural modulus of over 300 thousand and 400 thousand in the MD and CD directions respectively.

TLY-5Z demonstrates good dimensional stability, with a negative nominal value of approximately -0.05% in the MD direction. After thermal stress, it shows slightly more negative expansion, with a value of -0.07% for various thicknesses.

With a density of 1.92 g/cm³, TLY-5Z is a low-density laminate. It has a specific heat value of 0.95 J/g/℃ and a low moisture absorption rate of 0.03%. It also has a Durometer hardness of 68 and is UL 94V-0 compatible.

At Bicheng PCB, we offer TLY-5Z PCBs in various configurations, including double layer boards, multi-layer boards, and hybrid designs. We can provide standard thicknesses such as 10 mils, 20 mils, 30 mils, and 60 mils, and we can also customize the thickness in increments of 10 mils (0.250mm).

We offer finished copper on track lines with options of 1oz and 2oz. Our maximum PCB size on high-frequency materials is 400mm by 500mm, which can accommodate single boards or multiple designs on a panel.

Various solder mask colors such as green, black, blue, yellow, and red are available, and we offer surface pad plating options including immersion gold, HASL, immersion silver, immersion tin, OSP, pure gold, ENEPIG, and bare copper.

TheTLY-5Z boards are commonly used in aerospace components, low weight antennas for aircraft, and RF passive components.

In conclusion, TLY-5Z is not only a high-performance option but also an attractive choice from a cost perspective. It offers a more cost-effective alternative compared to traditional PTFE-rich copper clad laminates. TLY-5Z is suitable for high-volume commercial microwave applications where PTFE-rich substrates may be too expensive.