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TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil
TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil
TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil
TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil
Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
China
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Designation :
TSM-DS3
Dielectric constant :
3 +/-0.05
Dissipation factor :
0.0011
Dielectric thickness :
5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm)
PCB size :
≤400mm X 500mm
Copper weight :
1oz (35µm), 2oz (70µm)
Description

Material Introduction

TSM-DS3 is an exceptional thermally stable material that boasts industry-leading low loss properties with a dissipation factor (DF) of 0.0011 at 10 GHz. It offers the predictability and consistency comparable to the best fiberglass reinforced epoxies available in the market.

TSM-DS3 stands out as a ceramic-filled reinforced material with a remarkably low fiberglass content of approximately 5%. This unique composition allows it to rival epoxies in fabricating large format complex multilayers, making it an ideal choice for demanding applications.

One of the key highlights of TSM-DS3 is its suitability for high power applications. With a high thermal conductivity (TC) of 0.65 W/m*K, this material efficiently conducts heat away from other heat sources in a printed wiring board (PWB) design. This capability ensures effective heat dissipation and helps maintain optimal performance in high-power scenarios.

Moreover, TSM-DS3 has been developed to exhibit very low coefficients of thermal expansion, making it highly suitable for applications that undergo demanding thermal cycling. This exceptional feature enhances the material's performance and reliability, providing stability even in environments with significant temperature variations.

Features

1.TSM-DS3 offers an industry-leading dissipation factor (DF) of 0.0011 at 10GHz

2. With high thermal conductivity, TSM-DS3 effectively conducts heat away from heat sources.

3.The material has a low fiberglass content of approximately 5%.

4.TSM-DS3 exhibits dimensional stability comparable to epoxy materials.

5. It enables the fabrication of large format, high layer count printed wiring boards (PWBs) with complex designs.

6. The material allows for the successful construction of complex PCBs with high yield and consistent performance.

7. TSM-DS3 maintains stable dielectric constant (DK) within +/- 0.25 across a wide temperature range (-30 °C to 120 °C).

8. It is compatible with resistor foils, expanding its range of applications.

TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil

Typical Applications

TSM-DS3 finds application in various fields, including:

1. Couplers

2. Phased Array Antennas

3. Radar Manifolds

4. mmWave Antennas

5. Oil Drilling

6. Semiconductor / Automatic Test Equipment (ATE) Testing

Our PCB Capability (TSM-DS3)

PCB Material: Ceramic-filled Woven Fiberglass PTFE Laminates
Designation: TSM-DS3
Dielectric constant: 3 +/-0.05
Dissipation factor 0.0011
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

TSM-DS3 Typical Values

Property Test Method Unit TSM-DS3 Unit TSM-DS3
Dk IPC-650 2.5.5.3 3.00 3.00
TcK (-30 to 120 °C) IPC-650 2.5.5.5.1 (Modified) ppm 5.4 ppm 5.4
Df IPC-650 2.5.5.5.1 (Modified) 0.0011 0.0011
Dielectric Breakdown IPC-650 2.5.6 (ASTM D 149) kV 47.5 kV 47.5
Dielectric Strength ASTM D 149 (Through Plane) V/mil 548 V/mm 21,575
Arc Resistance IPC-650 2.5.1 Seconds 226 Seconds 226
Moisture Absorption IPC-650 2.6.2.1 % 0.07 % 0.07
Flexural Strength (MD) ASTM D 790/ IPC-650 2.4.4 psi 11,811 N/mm2 81
Flexural Strength (CD) ASTM D 790/ IPC-650 2.4.4 psi 7,512 N/mm2 51
Tensile Strength (MD) ASTM D 3039/IPC-650 2.4.19 psi 7,030 N/mm2 48
Tensile Strength (CD) ASTM D 3039/IPC-650 2.4.19 psi 3,830 N/mm2 26
Elongation at Break (MD) ASTM D 3039/IPC-650 2.4.19 % 1.6 % 1.6
Elongation at Break (CD) ASTM D 3039/IPC-650 2.4.19 % 1.5 % 1.5
Young’s Modulus (MD) ASTM D 3039/IPC-650 2.4.19 psi 973,000 N/mm2 6,708
Young’s Modulus (CD) ASTM D 3039/IPC-650 2.4.19 psi 984,000 N/mm2 6,784
Poisson’s Ratio (MD) ASTM D 3039/IPC-650 2.4.19 0.24 0.24
Poisson’s Ratio (CD) ASTM D 3039/IPC-650 2.4.19 0.20 0.20
Compressive Modulus ASTM D 695 (23.C) psi 310,000 N/mm2 2,137
Flexural Modulus (MD) ASTM D 790/IPC-650 2.4.4 kpsi 1,860 N/mm2 12,824
Flexural Modulus (CD) ASTM D 790/IPC-650 2.4.4 kpsi 1,740 N/mm2 11,996
Peel Strength (CV1) IPC-650 2.4.8 Sec 5.2.2 (TS) lbs/in 8 N/mm 1.46
Thermal Conductivity (unclad) ASTM F 433/ASTM 1530-06 W/M*K 0.65 W/M*K 0.65
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in. 0.21 mm/M 0.21
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in. 0.20 mm/M 0.20
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (TS) mils/in. 0.15 mm/M 0.15
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (TS) mils/in. 0.10 mm/M 0.10
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (ET) Mohms 2.3 x 10^6 Mohms 2.3 x 10^6
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (HC) Mohms 2.1 x 10^7 Mohms 2.1 x 10^7
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (ET) Mohms/cm 1.1 x 10^7 Mohms/cm 1.1 x 10^7
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (HC) Mohms/cm 1.8 x 10^8 Mohms/cm 1.8 x 10^8
CTE (x axis) (RT to 125ºC) IPC-650 2.4.41/TMA ppm/ºC 10 ppm/ºC 10
CTE (y axis) (RT to 125ºC) IPC-650 2.4.41/TMA ppm/ºC 16 ppm/ºC 16
CTE (z axis) (RT to 125ºC) IPC-650 2.4.41/TMA ppm/ºC 23 ppm/ºC 23
Density (Specific Gravity) ASTM D 792 g/cm3 2.11 g/cm3 2.11
Hardness ASTM D 2240 (Shore D) 79 79
Td (2% Weight Loss) IPC-650 2.4.24.6 (TGA) ºC 526 ºC 526
Td (5% Weight Loss) IPC-650 2.4.24.6 (TGA) ºC 551 ºC 551

TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil

Product tags

insb wafer

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ceramic substrate wafer uk

,

multilayer ceramic capacitors mlcc
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TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil

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Product Detail
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
China
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil
TSM-DS3 High Frequency Printed Circuit Board Ceramic Filled Reinforced Material 5mil

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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