Today, we are delighted to share our newly shipped PCB--based on 20mil RF-35TC high frequency lamnates. The RF-35TC PCB takes center stage as a cutting-edge solution for high-power applications, delivering exceptional performance in dissipating heat and maintaining low loss. With its unmatched thermal conductivity and minimal dissipation factor, this PCB substrate is engineered to excel in transmitting heat away from transmission lines and surface mount components, such as transistors or capacitors. Crafted from a PTFE-based material filled with ceramic and fiberglass, RF-35TC outshines its synthetic rubber counterparts by resisting oxidation, yellowing, and upward drift in dielectric constant.

Key Features:
- Thermally conductive low loss laminate
- DK of 3.5 +/- 0.05 at 10 GHz/23°C
- Dissipation factor of 0.002 at 10 GHz/23°C
- Thermal Conductivity of 0.87 W/m/K for 0.5oz copper cladded, 0.92W/m/K for 1oz copper cladded
- CTE in X-axis of 11 ppm/°C, Y-axis of 13 ppm/°C, and Z-axis of 34 ppm/°C
- Td 5% weight loss, 436°C
- Low Moisture Absorption of 0.05%

Benefits That Set RF-35TC Apart:
1. "Best in Class" Loss Tangent: Experience minimal signal loss and superior transmission efficiency.
2. Exceptional Thermal Management: Safeguard your high-power applications with superior heat dissipation capabilities.
3. Dk Stability Across a Broad Temperature Range: Ensure consistent performance in diverse environmental conditions.
4. Enhanced Antenna Gains/Efficiencies: Maximize the efficiency and performance of your antenna systems.
5. Excellent Adhesion to Very Low Profile Copper: Enjoy reliable and secure connections with exceptional adhesion.

Impeccable Construction and Specifications:
This newly shipped PCB features a 2-layer rigid stackup, meticulously crafted with a copper layer of 35 μm on both sides. The high-quality RF-35TC core boasts a thickness of 0.508 mm (20 mils). With a finished board thickness of 0.6 mm, this PCB is optimized for performance and durability. The copper weight of 1oz (1.4 mils) on the outer layers ensures robust connectivity. This PCB's construction adheres to the IPC-Class-2 standard, guaranteeing exceptional quality.

Unveiling the Dimensions:
This PCB measures 65.25 mm x 83 mm, allowing for effective integration into various systems. With a minimum trace/space of 4/4 mils and a minimum hole size of 0.25 mm, this PCB empowers your design with precision. The absence of blind vias simplifies the manufacturing process. The top solder mask is a vibrant green, complemented by a white top silkscreen. The bottom silkscreen is omitted for a sleek appearance. The via plating thickness is 20 μm, ensuring reliable connections throughout the board.

Rigorous Testing and Global Availability:
To ensure optimal performance, each PCB undergoes a 100% electrical test before shipment, guaranteeing its reliability and functionality. With global availability, this high-performance PCB is ready to be incorporated into your projects anywhere in the world.

Countless Applications, Limitless Possibilities:
This high frequency PCB finds its footing in a wide array of applications, including:
- Filters, Couplers & Power: Experience top-notch performance in critical power applications.
- Amplifiers: Unleash the full potential of your amplifiers with this high-performance substrate.
- Antennas: Enhance the efficiency and gain of your antennas for superior signal transmission.
- Satellites: Trust in the reliability and thermal management capabilities of RF-35TC for satellite systems.

In conclusion, RF-35TC sets a new benchmark for high-power PCB substrates. Its combination of low dissipation factor, high thermal conductivity, and exceptional stability empowers engineers to push the boundaries of performance and efficiency in their high-power applications. Experience the revolutionary capabilities of RF-35TC and elevate your projects to new heights of performance and reliability.