Specifications
Brand Name :
Bicheng
Model Number :
BIC-040.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
RO3003
Layer count :
2 layers
PCB thickness :
1.6mm
PCB size :
88 x 92mm=1PCS
Silkscreen :
Black
Copper weight :
0.5oz
Surface finish :
immersion gold
Description

Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3003 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:

1) Cellular telecommunications systems

2) Direct broadcast satellites

3) Global positioning satellite antennas

4) Remote meter readers

PCB Specifications

PCB SIZE 88 x 92mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3003 1.524mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.4 mm / 5.2 mm
Number of Different Holes: 7
Number of Drill Holes: 95
Number of Milled Slots: 0
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3003 1.524mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±10%
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: NO
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend Black
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

Data Sheet of Rogers 3003 (RO3003)

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23 IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/ 10 GHz -50to 150 IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07
X
Y
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 COND A IPC 2.5.17.1
Tensile Modulus 930
823
X
Y
MPa 23 ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50 ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288
)
17
16
25
X
Y
Z
ppm/ 23/50% RH IPC-TM-650 2.4.4.1
Td 500 TGA ASTM D 3850
Density 2.1 gm/cm3 23 ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

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Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

Ask Latest Price
Brand Name :
Bicheng
Model Number :
BIC-040.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001
Rogers RO3003 RF Printed Circuit Board 2-Layer Rogers 3003 60mil 1.524mm PCB with Low DK3.0 and Low DF 0.001

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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