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RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask
RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask
Specifications
Brand Name :
Bicheng
Model Number :
BIC-049.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
RO3010
Layer count :
2 layers
PCB thickness :
0.8mm
PCB size :
100 x 100mm=1PCS
Solder mask :
Green
Silkscreen :
White
Copper weight :
0.5oz
Surface finish :
immersion gold
Description

Rogers Microwave PCB Made on RO3010 25mil 0.635mm DK10.2 With Gold for Patch Antenna for Wireless Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3010 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3010 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:

1) Automotive radar

2) Cellular telecommunications systems

3) Datalink on cable systems

4) Direct broadcast satellites

5) Global positioning satellite antennas

6) Patch antenna for wireless communications

7) Power amplifiers and antennas

8) Power backplanes

9) Remote meter readers

PCB Specifications

PCB SIZE 100 x 100mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3010 0.635mm
copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 6 mil / 6 mil
Minimum / Maximum Holes: 0.3mm / 1.5mm
Number of Different Holes: n/a
Number of Drill Holes: n/a
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3010 0.635mm
Final foil external: 1oz
Final foil internal: N/A
Final height of PCB: 0.8 mm ±0.1mm
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Bottom
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA N/A
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask

Data Sheet of Rogers 3010 (RO3010)

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 MΩ COND A IPC 2.5.17.1
Tensile Modulus 1902
1934		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.05 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 j/g/k Calculated
Thermal Conductivity 0.95 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 13
11
16		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.8 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Product tags

pcb solder mask

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solder mask pcb

,

solder mask dielectric constant
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RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-049.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
RO3010 25mil 0.635mm Microwave PCB Board LPSM Solder Mask

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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