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Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers
Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers
Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers
Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers
Specifications
Brand Name :
Bicheng
Model Number :
BIC-149.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
Ceramic, Hydrocarbon, Thermoset Polymer Composites
Layer count :
Double Layer, Multilayer, Hybrid PCB
PCB size :
≤400mm X 500mm
PCB thickness :
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500m
Solder mask :
Green, Black, Blue, Yellow, Red etc.
Copper weight :
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish :
Bare copper, HASL, ENIG, OSP etc..
Description

Rogers Microwave PCBs Built on 25mil 0.635mm TMM10 with Green Solder Mask for Dielectric Polarizers and Lenses

Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.

The electrical and mechanical properties of TMM10 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials.

TMM10 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material’s isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM10 laminates is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.

TMM10 laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.

Some Typical Applications:

1. Filters and coupler

2. Patch Antennas

3. Power amplifiers and combiners

4. Satellite communication systems

Our Capabilities (TMM10)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10
Dielectric constant: 9.20 ±0.23
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Data Sheet of TMM10

TMM10 Typical Value
Property TMM10 Direction Units Condition Test Method
Dielectric Constant,εProcess 9.20±0.23 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.8 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0022 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -38 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 285 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 21 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 21 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 13.62 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.79 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.09 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.74 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers

Product tags

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dual c-band lnb

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Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-149.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Contact Supplier
Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers
Rogers TMM10 Microwave PCB Board 25mil 0.635mm For Dielectric Polarizers

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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