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15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers
15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers
15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers
15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers
Specifications
Brand Name :
Bicheng
Model Number :
BIC-148.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
Ceramic, Hydrocarbon, Thermoset Polymer Composites
Layer count :
Double Layer, Multilayer, Hybrid PCB
PCB size :
≤400mm X 500mm
PCB thickness :
15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500m
Solder mask :
Green, Black, Blue, Yellow, Red etc.
Copper weight :
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish :
Bare copper, HASL, ENIG, OSP etc..
Description

Rogers 15mil TMM10 High Frequency PCB With Immersion Gold and Green Solder Mask for Chip Testers

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers’ TMM10 thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications.

TMM10 laminates' electrical and mechanical characteristics combine many of the advantages of ceramic and conventional PTFE microwave circuit laminates without the need for the specific manufacturing processes typical of these materials.

The thermal coefficient of dielectric constant of TMM10 laminates is typically less than 30 ppm/°C, which is extremely low. The material can produce high reliability plated through holes with minimal etch shrinkage values thanks to its isotropic coefficients of thermal expansion, which are extremely closely matched to those of copper. Additionally, TMM10 laminates' thermal conductivity is about twice as high as that of conventional PTFE/ceramic laminates, making it easier to remove heat from the system.

The thermoset resins used in TMM10 laminates prevent them from softening when heated. As a result, there is no need to worry about pad lifting or other issues while wire bonding component leads to circuit traces.

Some Typical Applications:

1. Filters and coupler

2. Power amplifiers and combiners

3. RF and microwave circuitry

Our Capabilities (TMM10)

PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM10
Dielectric constant: 9.20 ±0.23
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Data Sheet of TMM10

TMM10 Typical Value
Property TMM10 Direction Units Condition Test Method
Dielectric Constant,εProcess 9.20±0.23 Z 10 GHz IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 9.8 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0022 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -38 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 108 - Mohm.cm - ASTM D257
Surface Resistivity 4 x 107 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 285 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 21 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 21 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 20 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.76 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.0 (0.9) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 13.62 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.79 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.09 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.77 - - A ASTM D792
Specific Heat Capacity 0.74 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -

Product tags

solder mask pcb

,

pcb solder mask

,

pcb guide
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15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-148.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers
15mil TMM10 Rogers PCB Board With Green Solder Mask For Chip Testers

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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