Via in Pad PCB High Density Multilayer PCB Via Filled Circuit Board with Immersion Gold for GPS Tracking Devices
1.1 General description
This is a type of 6 layer printed circuit board built on FR-4 Tg170 substrate for the application of GPS Tracking Devices. It's 1.6 mm thick with white silkscreen on green solder mask and immersion gold on pads. The base material is from ITEQ supplying 1 up single board. Vias with 0.3mm are resin filled and plated flatly (via in pad). They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment.
1.2 Features and benifits
RoHS compliant and suitable for high thermal reliability needs
Excellent surface planarity for CSP mounted components to reduce failure rate during assembly and soldering.
Reliability test, insulation resistance test and ionic contamination test
16000 square meter workshop
12 hours quotation
No quality complaint is meant to save money
1.3 Applications
Inverters
Router ADSL
Industrial Computer
Weather analysis
1.4 Parameter and data sheet
Number of Layers | 6 |
Board Type | Multi-layer PCB |
Board size | 54.99 x 87.50mm=1UP |
Board Thickness | 1.6mm +/-0.16 |
Board Material | FR-4 |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 170℃ |
|
PTH Cu thickness | ≥20 um (See hole wall details) |
Inner Iayer Cu thicknes | 35 um (1oz) |
Surface Cu thickness | 35 um (1oz) |
|
Solder Mask Type and Model No. | LPSM, PSR-2000GT600D |
Solder Mask Supplier | TAiYO |
Solder Mask Colour | Green |
Number of Solder Masks | 2 |
Thickness of Solder Mask | 13um |
|
Type of Silkscreen Ink | TAIYO, IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
|
Mininum Trace (mil) | 7 mil |
Minimum Gap(mil) | 4.9 mil |
|
Surface Finish | Immersion Gold |
RoHS Required | Yes |
Warpage | 0.25% |
Drill table (mm) | |
T1 | 1.000 |
T2 | 3.175 |
| |
Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Solderablity Test | Pass, 255±5℃,5 seconds Wetting Area Least 95% |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |
Drill table (mm) | T1: 0.600 |
T2: 0.700 |
T3:0.800 |
T4: 1.000 |
T5: 1.100 |
T6: 1.250 |
T7: 1.850 |
T8: 4.000 |
T9: 4.325 |

1.5 Design For Manufacture (1)
Serial NO. | Procedure | Item | Manufacturing capability |
Large volume (S<100 m²) | Middle volume (S<10 m²) | Prototype(S<1m²) |
1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.isolation of layers | 0.1mm | 0.1mm | 0.06mm |
2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) |
3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) |
4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) |
5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) |
6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) |
7 | Min.distance from drill to conductor | 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil | 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil | 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil |
8 | Min.width of annular ring on inner layer | 4 Layer 10mil(35um),≥6 Layer 14mil(35um) | 4 Layer 8mil(35um),≥6 layer 12mil(35um) | 4 Layer 6mil(35um),≥6 Layer 10mil(35um) |
9 | Inner layer isolation ring width(Min) | 10mil (35um) | 8mil (35um) | 6mil (35um) |
10 | Min.via pad diameter | 20mil (35um) | 16mil (35um) | 16mil (35um) |
11 | Min. distance from board edge to conductor(no copper exposured)(inner layer) | 14 mil(35um) | 12 mil(35um)) | 8 mil(35um) |
12 | Maximum copper weight(Inner layer and outer layer) | 3 OZ( 105 um ) | 4 OZ ( 140 um ) | 6 OZ( 210 um ) |
13 | Core with different copper foil on both sides | / | 18/35,35/70 um | 18/35,35/70 um |