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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
Specifications
Brand Name :
Bicheng
Model Number :
BIC-483.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
FR-4
Layer count :
24 layers
PCB thickness :
3.7mm ±0.10%
PCB size :
400 x 212mm=1PCS
Solder mask :
Green
Silkscreen :
White
Copper weight :
1oz
Surface finish :
Immersion gold
Description
Multilayer PCB 24 Layer Printed Circuit Board Built On High Temperature FR-4 With 50 Ohm / 100 Ohm Impedance for Industrial controls
General description
This is a type of high multilayer PCB built on FR-4 substrate with Tg 170°C for the application of Industrial controls with 24 layer copper track. It's 3.7 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. This is also an impedance controlled PCB with single-end impedance of 50 ohm and differential impedance of 100 ohm. The base material is from ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 panels are packed for shipment.
Features and benifits
Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
Long storage time ( It can be stored for more than 1 year in vacuum bag)
The signal lines form a constant low impedance to the ground
Micro-section and thermal stress test
16000 square meter workshop
Small quantity order is accepted
ISO9001, ISO14001, IATF16949, UL Certified
We can find its Applications in transmitter, GSM Modem, 3G WiFi Router, phase Shifter, embedded Controller, hard drives.

24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
Printed Circuit Board Capability 2020
Parameter Value
　Layer Counts　 1-32
　Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
　Maximum Size 　Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
　Board Outline Tolerance 　±0.0059" (0.15mm)
　PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) 　±8%
Thickness Tolerance(t＜0.8mm) 　±10%
　Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
　Minimum Track 0.003" (0.075mm)
　Minimum Space 　0.003" (0.075mm)
　Outer Copper Thickness 　35µm--420µm (1oz-12oz)
　Inner Copper Thickness 　17µm--420µm (0.5oz - 12oz)
　Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
　Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
　Registration (Mechanical) 0.00197" (0.05mm)
　Aspect Ratio 　12:1
　Solder Mask Type 　LPI
　Min Soldermask Bridge 0.00315" (0.08mm)
　Min Soldermask Clearance 0.00197" (0.05mm)
　Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance 　±10%
　Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
Parameter and data sheet
PCB SIZE 400 x 212mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 24 Layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP TOP LAYER 0.018mm+plating Layer 1
Prepreg 0.1016mm
PLANE 1 --- 0.035mm Layer 2
CORE FR4 0.1016mm
GROUND 1 --- 0.035mm Layer 3
Prepreg 0.127mm
SIGNAL 1 --- 0.018mm
CORE FR4 0.1524mm
PLANE 2 --- 0.035mm
Prepreg 0.1016mm
GROUND 2 --- 0.035mm
CORE FR4 0.127mm
SIGNAL 2 --- 0.018mm
Prepreg 0.1524mm
PLANE 3 --- 0.035mm
CORE FR4 0.1016mm
PLANE,GROUND 7 --- 0.035mm
Prepreg 0.127mm
SIGNAL 3 --- 0.018mm
CORE FR-4 0.1524mm
GROUND 3 --- 0.035mm
Prepreg 0.127mm
SIGNAL 4 --- 0.018mm
CORE FR4 0.1524mm
PLANE 4 --- 0.035mm
Prepreg 0.1016mm
GROUND 4 --- 0.035mm
CORE FR4 0.1016mm
SIGNAL 5 --- 0.018mm
Prepreg 0.1524mm
SIGNAL 6 --- 0.018mm
CORE FR4 0.1016mm
PLANE 5 --- 0.035mm
Prepreg 0.1016mm
GROUND 5 --- 0.035mm
CORE FR4 0.1524mm
SIGNAL 7 --- 0.018mm
Prepreg 0.127mm
PLANE 6 --- 0.035mm
CORE FR4 0.1524mm
SIGNAL 8 --- 0.018mm
Prepreg 0.127mm
POWER, RROUND 8 --- 0.035mm Layer 22
CORE FR4 0.1016mm
GROUND 6 --- 0.035mm Layer 23
Prepreg 0.1016mm
BOTTOM LAYER --- 0.018mm + plating Layer 24
TECHNOLOGY
Minimum Trace and Space: 5 mil / 5 mil
Minimum / Maximum Holes: 0.36 /3.2mm
Number of Different Holes: 9
Number of Drill Holes: 9117
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: Yes, all of signal layers of 8 copper layers, 50 OHM Impedance Controlled for single ended on 5 mil track & 100 OHM for Differential routes on 5mil / 8 mil
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: FR-4 Tg170℃, er<5.4.IT-180, ITEQ Supplied
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 3.7mm ±0.10%
PLATING AND COATING
Surface Finish Immersion gold (29.1% ) 0.05µm over 3µm nickel
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Green, PSR-2000 KX700G, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP and Bottom.
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Via hole filling at BGA required.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
Product tags

thermal conductivity of fr4 pcb

,

fr4 pcb thermal conductivity

,

fr4 pcb temperature rating
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24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-483.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance
24 Layer FR4 PCB Board High Temperature With 100 Ohm Impedance

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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