Number of Layers | N/A |
Board Type | Blank Spacer |
Board Size | 78.36 x 52.83mm=1UP |
Board Thickness | 1.5mm +/-0.15 |
Board Material | FR-4 |
Board Material Supplier | ILM |
Tg Value of Board Material | TG135℃ |
PTH Cu thickness | N/A |
Inner Iayer Cu thicknes | N/A |
Surface Cu thickness | N/A |
Solder Mask Type and Model No. | N/A |
Solder Mask Supplier | N/A |
Solder Mask Colour | N/A |
Number of Solder Masks | N/A |
Thickness of Solder Mask | N/A |
Type of Silkscreen Ink | N/A |
Supplier of Silkscreen | N/A |
Color of Silkscreen | N/A |
Number of Silkscreen | N/A |
Mininum Trace (mil) | N/A |
Minimum Gap(mil) | N/A |
Surface Finish | N/A |
RoHS Required | Yes |
Warpage | 0.15% |
Thermal Shock Test | Pass, 288±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Solderablity Test | N/A |
Function | visual inspection |
Workmanship | Compliance with IPC-A-600H & IPC-6012C Class 2 |