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4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
Specifications
Brand Name :
Bicheng
Model Number :
BIC-076.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
RO4350B + FR4; RO4003C + FR4; F4B + FR4; RT/duroid5880 + FR4; RT/duroid5880 + RO4350B
Layer count :
4 Layer, 6 Layer, Multilayer
PCB thickness :
1.0-5.0mm
PCB size :
≤400mm X 500mm
Solder mask :
Green, Red, Blue, Black, Yellow
Coppper weight :
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish :
Bare copper, HASL, ENIG, Immersion tin, OSP
Description

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,

Warm greetings!

Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and FR-4.

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil RO4003C core, which is the main wiring layer for the signal lines. Layer 3 to layer 4 is the core of FR-4, both cores are combined through 0.2mm prepeg. Each layer is connected by plated through holes. The inner layer and out layer of copper is 1 ounce. This is a good method to keep the board cost effective.

Let's take a look at its micro-section chart.

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Following is another type of 20mil RO4003C hybrid PCB. It’s made of 2 cores of 20mil RO4003C.

4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

The applications of 20mil RO4003C hybrid PCB is wide, such as LNA, optical coupler, balanced amplifier, duplexer etc.

The advantages of 20mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

Our PCB Capability (Hybrid Design)

PCB Capability
PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
　 RO4003C + FR4;
　 F4B + FR4;
　 RT/duroid5880 + FR4;
　 RT/duroid5880 + RO4350B
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP
　 　

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

Appendix: Data Sheet of RO4003C

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021		 Z 10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109 MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)		 MPa
(kpsi)		 IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃ TMA A IPC-TM-650 2.4.24.3
Td 425 ℃ TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)		 N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes

Product tags

fr4 boards for pcb

,

fr4 pcb board

,

fr4 design pcb
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4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-076.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99
Contact Supplier
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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