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60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
Specifications
Brand Name :
Bicheng
Model Number :
BIC-137.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
Hydrocarbon Ceramic Laminates
Layer count :
Double Layer, Multilayer, Hybrid PCB
PCB size :
≤400mm X 500mm
PCB thickness :
10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
Solder mask :
Green, Black, Blue, Yellow, Red etc.
Copper weight :
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish :
Bare copper, HASL, ENIG, OSP, Immersion tin etc..
Description

Dual Layer Rogers PCB Built on 60.7mil RO4350B LoPro Reverse Treated Foil With ENIG for High Speed Back Planes

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

CAF resistant

Our PCB Capability (RO4350B LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4350B LoPro
Dielectric constant: 3.48±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes

Typical Properties of RO4350B LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.48 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.55 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0037 0.0031 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 50 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 X 109 MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 11473(1664) Y MPa(kpsi) RT ASTM D638
Tensile Strength 175(25.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 255(37) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 14 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
16 y
35 z
Tg >280 °C TMA A IPC-TM-650 2.4.24.3
Td 390 °C TGA ASTM D3850
Thermal Conductivity 0.62 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.86 gm/cm3 23°C ASTM D792
Copper Peel Strength 0.88(5.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes

60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes

Product tags

large rc model planes

,

large rc planes arf

,

rc model planes
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60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-137.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Contact Supplier
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes
60.7mil RO4350B LoPro Rogers PCB Board For High Speed Back Planes

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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