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Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Specifications
Brand Name :
Bicheng
Model Number :
BIC-123.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
Ceramic-filled Laminates Reinforced with Woven Fiberglass
Layer count :
Double Layer, Multilayer, Hybrid PCB
PCB thickness :
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size :
≤400mm X 500mm
Solder mask :
Green, Black, Blue, Yellow, Red etc.
Copper weight :
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Surface finish :
Bare copper, HASL, ENIG, OSP etc..
Description

Rogers RO3203 Double Sided 30mil High Frequency PCB With Green Mask For Wireless Telecommunications Systems

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using

standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

Features:

1. Woven glass reinforcement improves rigidity for easier handling.

2. Low dielectric loss for high frequency performance can be used in applications exceeding 20 GHz.

3. Low in-plane expansion coefficient (matched to copper) is suitable for use with epoxy glass multilayer board hybrid designs and reliable surface mounted assemblies.

4. Surface smoothness allows for finer line etching tolerances

Typical Applications:

1. Base Station Infrastructure

2. Remote Meter Readers

3. Wireless Telecommunications Systems

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Data Sheet of RO3203

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2) W/mK Float 100℃ ASTM C518
Volume Resistivity 107 MΩ.cm A ASTM D257
Surface Resistivity 107 MΩ A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1 % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500 ℃ TGA ASTM D3850
Density 2.1 gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74) lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes

Product tags

double sided printed circuit board

,

printed circuit boards fr4

,

fr4 printed circuit board
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Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

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Product Detail
Brand Name :
Bicheng
Model Number :
BIC-123.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Contact Supplier
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards
Rogers 3203 PCB 30mil Double Sided Printed Circuit Boards

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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