Specifications
Brand Name :
Bicheng
Model Number :
BIC-168.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Base material :
PTFE Ceramic Fiberglass
Layer count :
Double Layer, Multilayer, Hybrid PCB
PCB thickness :
10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size :
≤400mm X 500mm
Solder mask :
Green, Black, Blue, Yellow, Red etc.
Copper weight :
0.5oz (17 µm), 1oz (35µm)
Surface finish :
Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..
Description

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

Benefits:

- The material has low loss properties, which means that it does not dissipate much energy in the form of heat and can maintain high signal integrity.


- The DK tolerance of +/- 0.05 ensures that the material maintains consistent electrical performance, which is important for high-speed communication applications.


- The homogeneous DK means that the material has uniform electrical properties throughout, which can help to reduce signal distortion and improve electrical performance.


- The excellent peel strength means that the material can maintain strong adhesion between layers, which is important for maintaining the integrity and reliability of the PCB.


- The low moisture absorption means that the material is less likely to be affected by changes in humidity or temperature, which can help to maintain electrical performance and prevent damage to the PCB.

Our PCB Capability (RF-35A2)

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35A2
Dielectric constant: 3.15
Dissipation Factor 0.0015
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

The applications are power amplifiers, filters / couplers, high speed digital, passive components, wireless antennas etc.

RF-35A2 Typical Values

RF-35A2 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 3.5 3.5
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 0.0015 0.0015
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Dielectric Breakdown IPC-650 2.5.6/ASTM D 149 kV 59 kV 59
Dielectric Strength ASTM D 149 V/mil 1000 V/mm 39,370
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm/cm 10^9 Mohm/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm 10^8 Mohm 10^8
Arc Resistance IPC-650 2.5.1 Seconds 242 Seconds 242
Flexural Strength (MD) IPC-650 2.4.4 kpsi 24 N/mm2 165
Flexural Strength (CD) IPC-650 2.4.4 kpsi 15 N/mm2 103
Tensile Strength (MD) ASTM D 3039 psi 16,800 N/mm2 116
Tensile Strength (CD) ASTM D 3039 psi 11,000 N/mm2 75.8
Young’s Modulus (MD) ASTM D 3039 psi 106 N/mm2 8,343
Young’s Modulus (CD) ASTM D 3039 psi 106 N/mm2 7,171
Poisson’s Ratio (MD) ASTM D 3039 0.14 0.14
Poisson’s Ratio (CD) ASTM D 3039 0.1 0.1
Strain at Break (MD) ASTM D 3039 % 1.6 % 1.6
Strain at Break (CD) ASTM D 3039 % 1.4 % 1.4
Compressive Modulus (Z axis) ASTM D 695 (23°C) kpsi 385 N/mm2 2,650
Peel Strength (1 oz. VLP) IPC-650 2.4.8 (Thermal Stress) lbs/in 12 N/mm 2.1
Peel Strength (1 oz. VLP) IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) lbs/in 14 N/mm 2.5
Peel Strength (1 oz. VLP) IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) lbs/in 11 N/mm 2
Density (Specific Gravity) gm/cm3 2.28 gm/cm3 2.28
Specific Heat ASTM E 1269 (DSC) (100°C) J/g/K 0.99 J/g/K 0.99
Thermal Conductivity ASTM F 433 W/M*K 0.29 W/M*K 0.29
Td IPC-650 2.4.24.6 2% Weight Loss °C 528 °C 528
Td IPC-650 2.4.24.6 5% Weight Loss °C 547 °C 547
CTE (x) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 10 ppm/°C 10
CTE (y) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 13 ppm/°C 13
CTE (z) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 108 ppm/°C 108

Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

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Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

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Brand Name :
Bicheng
Model Number :
BIC-168.V1.0
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Payment Terms :
T/T
Contact Supplier
Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold
Double Layer RF-35A2 PCB 20mil Taconic PCB With Immersion Gold

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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