Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Material :
RT/duroid 6035HTC
Layer count :
2-layer
PCB size :
49.23mm x 55.55 mm=1PCS, +/- 0.15mm
PCB thickness :
30mil
Copper weight :
1oz (1.4 mils) outer layers
Surface finish :
Immersion Gold
Description

The RT/duroid 6035HTC PCB is engineered from high-frequency circuit materials designed specifically for high-power RF and microwave applications. Utilizing ceramic-filled PTFE composites, this PCB is an exceptional choice for demanding environments where thermal management and performance are critical. With a thermal conductivity nearly 2.4 times that of standard RT/duroid 6000 products, it ensures efficient heat dissipation, making it ideal for high-power applications.

Key features of the RT/duroid 6035HTC PCB include a dielectric constant (DK) of 3.5 ± 0.05 at 10 GHz and 23°C, along with an impressive dissipation factor of 0.0013 at the same frequency and temperature. The material exhibits a thermal coefficient of dielectric constant of -66 ppm/°C and a moisture absorption rate of just 0.06%. Additionally, with a thermal conductivity of 1.44 W/m/K at 80°C, this PCB provides excellent thermal performance, contributing to lower operating temperatures and enhanced reliability in high-power scenarios.

RT/duroid 6035HTC Typical Value
Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z 8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108 MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108 A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06 % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44 W/m/k 80℃ ASTM C518
Density 2.2 gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9 pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

The construction of this PCB features a 2-layer rigid stackup, comprising 35 μm of copper on both layers and a 0.762 mm (30 mil) core of RT/duroid 6035HTC. Precise board dimensions of 49.23 mm x 55.55 mm (± 0.15 mm) are complemented by a finished board thickness of 0.83 mm and a minimum trace/space of 6/5 mils. With a minimum hole size of 0.6 mm and no blind vias, this PCB is crafted to meet stringent performance specifications. The immersion gold surface finish ensures excellent solderability, while the blue top solder mask enhances visibility during assembly.

This PCB is compatible with the Gerber RS-274-X artwork format and adheres to the IPC-Class-2 quality standard, ensuring it meets industry expectations. Additionally, it is available for worldwide, making it accessible to engineers globally.

Typical applications for the RT/duroid 6035HTC PCB include high-power RF and microwave amplifiers, couplers, filters, combiners, and power dividers. With its advanced thermal management capabilities and excellent high-frequency performance, this PCB is an invaluable asset for modern electronic designs demanding reliability and efficiency.

RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

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RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

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Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit
RT duroid 6035HTC PCB 30mil 2-Layer Immersion Gold Circuit

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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