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3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit
3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit
Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Material :
RO3210 and RO3003
Layer count :
3-layer
PCB size :
62.8mm x 62.8 mm=1PCS, +/- 0.15mm
PCB thickness :
3mm
Copper weight :
1oz (1.4 mils) outer layers
Surface finish :
Immersion Tin
Description

Introducing our newly shipped hybrid printed circuit board (PCB), designed for high-frequency applications with unmatched performance and reliability. This advanced PCB combines Rogers’ RO3210 and RO3003 materials, providing a unique blend of mechanical stability and excellent electrical characteristics, making it ideal for a wide range of demanding applications.

Key Features

RO3210 Material
- Dielectric Constant (Dk): 10.2 ± 0.5
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Stability:
- Coefficient of Thermal Expansion (CTE):
- X & Y axes: 13 ppm/°C
- Z axis: 34 ppm/°C
- Decomposition Temperature (Td): 500 °C
- Thermal Conductivity: 0.81 W/mK
- Flammability Rating: V0 (UL 94 standard)

RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z 10 GHz 23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz 23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 103 MΩ COND A IPC 2.5.17.1
Tensile Modulus 579
517		 MD
CMD		 kpsi 23℃ ASTM D 638
Water Absorption ＜0.1 - % D24/23 IPC-TM-650 2.6.2.1
Specific Heat 0.79 j/g/k Calculated
Thermal Conductivity 0.81 W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)		 13
34
 X,Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D3850
Density 3 gm/cm3
Copper Peel Stength 11 pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

RO3003 Material
- Dielectric Constant (Dk): 3 ± 0.04 at 10 GHz/23°C
- Dissipation Factor: 0.001 at 10 GHz/23°C
- Thermal Stability:
- Td: > 500 °C
- Coefficient of Thermal Expansion:
- X axis: 17 ppm/°C
- Y axis: 16 ppm/°C
- Z axis: 25 ppm/°C
- Moisture Absorption: 0.04%
- Thermal Conductivity: 0.5 W/mK

RO3003 Typical Value
Property RO3003 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.04 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.001 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -3 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.06
0.07		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 107 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 107 MΩ COND A IPC 2.5.17.1
Tensile Modulus 930
823		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.04 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.9 j/g/k Calculated
Thermal Conductivity 0.5 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 17
16
25		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.1 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 12.7 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

PCB Specifications

- Stackup: 3-layer rigid PCB

- Copper Layer 1: 35 μm
- Rogers RO3003 Core: 1.524 mm (60 mil)
- RO4450F Bondply: 0.101 mm (4 mil)
- Rogers RO3210 Core: 1.27 mm (50 mil)
- Copper Layer 1: 35 μm

- Dimensions: 62.8 mm x 62.8 mm ± 0.15 mm
- Finished Board Thickness: 3.0 mm
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers
- Minimum Trace/Space: 7/9 mils
- Minimum Hole Size: 0.4 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Tin
- Electrical Testing: 100% electrical test prior to shipment

3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

Application Areas

This hybrid PCB is tailored for various high-performance applications, including:

- Automotive Technologies: Collision avoidance systems and global positioning satellite antennas
- Telecommunications: Wireless systems, microstrip patch antennas, and direct broadcast satellites
- Remote Monitoring: Datalink on cable systems and remote meter readers
- Infrastructure Solutions: Power backplanes, LMDS, wireless broadband, and base station infrastructure

Quality Assurance

Manufactured to IPC-Class 2 standards, this PCB ensures high reliability and performance. The artwork is provided in Gerber RS-274-X format, making it compatible with standard PCB design tools.

Global Availability

Our hybrid PCB is available for worldwide shipping, allowing you to leverage cutting-edge technology in your projects, no matter your location.

3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

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3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

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Product Detail
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
3mm Hybrid PCB on Rogers RO3210 and RO3003 Materials 3-layer Circuit

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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