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4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold
4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold
Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Material :
RT/duroid 5880 and RO4003C
Layer count :
4-layer
PCB size :
110mm x 51mm=1PCS, +/- 0.15mm
PCB thickness :
1.3mm
Copper weight :
1oz (1.4 mils) inner/outer layers
Surface finish :
Immersion Gold
Description

Introducing our newly shipped 4-layer printed circuit board (PCB) engineered with high-performance materials—Rogers RT/duroid 5880 and RO4003C. This PCB is designed for high-frequency and broadband applications, offering exceptional electrical properties and reliability.


Material Introductions

RT/duroid 5880
Rogers RT/duroid 5880 is a high-frequency laminate made from PTFE composites reinforced with glass microfibers. This material features:
- Low Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz
- Low Loss: Dissipation factor of 0.0009 at 10 GHz
- Uniformity: Randomly oriented microfibers enhance Dk stability.

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

RO4003C
Rogers RO4003C is a proprietary woven glass reinforced hydrocarbon/ceramic material that combines:
- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Cost-Effectiveness: Utilizes standard epoxy/glass processing methods.
- Low Moisture Absorption: 0.06%, enhancing reliability.
RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021		 Z 10 GHz/23℃
2.5 GHz/23℃		 IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109 MΩ COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)		 X
Y		 MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)		 X
Y		 MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)		 MPa
(kpsi)		 IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)		 after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46		 X
Y
Z		 ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃ TMA A IPC-TM-650 2.4.24.3
Td 425 ℃ TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃		 ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)		 N/mm
(pli)		 after solder float 1 oz.
EDC Foil		 IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold


PCB Specifications

Stackup:

Copper Layer 1: 35 μm

RT/duroid 5880: 0.787 mm (31 mil)

Copper Layer 2: 35 μm

RO4450F Prepreg Bondply: 0.101 mm (4 mil)

Copper Layer 3: 35 μm

RO4003C: 0.203 mm (8 mil)

Copper Layer 4: 35 μm

This PCB measures 110 mm x 51 mm ± 0.15 mm, with a finished thickness of 1.3 mm and a copper weight of 1 oz (1.4 mils) on both inner and outer layers. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3 mm, with a via plating thickness of 20 μm.

For surface finish, it uses immersion gold, complemented by a green solder mask on the top side and no mask on the bottom. A white silkscreen is applied on the top for clear component labeling. Each PCB is 100% electrically tested before shipment to ensure high quality and reliability.


Typical Applications

- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Applications
- Radar Systems
- Guidance Systems
- Point-to-Point Digital Radio Antennas

Quality Assurance

This PCB meets IPC-Class 2 standards and is supplied with Gerber RS-274-X artwork format, ensuring compatibility with industry-standard PCB design software.


Global Availability

Available for worldwide shipping, our advanced PCB technology is ready to support your high-frequency application needs.

4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

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4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

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Product Detail
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
4-Layer Hybrid PCB with RT/duroid 5880 and RO4003C Materials Immersion Gold

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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