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RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Material :
RF-10
PCB thickness :
60mil
PCB size :
40 mm x 40 mm ± 0.15 mm
Layer count :
2-layer
Copper weight :
1OZ
Surface finish :
Immersion Silver
Description

We are pleased to introduce our newly shipped 2-layer printed circuit board (PCB) featuring RF-10 copper clad laminates. Engineered for high-frequency applications, RF-10 combines ceramic-filled PTFE and woven fiberglass to deliver a cost-effective substrate with exceptional electrical and thermal performance.

Key Features

The RF-10 material boasts a dielectric constant of 10.2 ± 0.3 at 10 GHz and a low dissipation factor of 0.0025, making it ideal for RF circuit size reduction. Its high thermal conductivity of 0.85 W/mK ensures effective thermal management, while its tight dimensional tolerances enhance stability in multilayer circuits. The material is also resistant to moisture (0.08% absorption) and has a flammability rating of V-0, ensuring safety and reliability.

RF-10 Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod. 10.2 ± 0.3 10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod. 0.0025 0.0025
TcK† (-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal V-0 V-0

PCB Specifications

This PCB features a well-structured stackup, consisting of:

- Copper Layer 1: 35 μm (1 oz)
- RF-10 Core: 60 mil (1.524 mm)
- Copper Layer 2: 35 μm (1 oz)

The overall dimensions of this PCB are 40 mm x 40 mm ± 0.15 mm, with a finished thickness of 1.6 mm. The PCB supports a minimum trace/space of 7/8 mils and a minimum hole size of 0.4 mm. It includes 1 oz finished copper weight on both outer layers and a via plating thickness of 20 μm.

For surface finish, it utilizes immersion silver, complemented by a black solder mask on the top side. A white silkscreen is applied for clear labeling, while the bottom side remains without a silkscreen or solder mask. Each PCB undergoes 100% electrical testing prior to shipment to ensure high quality and performance.

PCB Material: Composites of Ceramic Filled PTFE and Woven Fiberglass
Designation: RF-10
Dielectric constant: 10.2
Dissipation Factor 0.0025 10GHz
Layer count: Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 60mil (1.524mm ), 125mil ( 3.175mm )
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

Applications

This versatile PCB is suitable for a variety of applications, including:

- Microstrip Patch Antennas
- GPS Antennas
- Passive Components (filters, couplers, power dividers)
- Aircraft Collision Avoidance Systems
- Satellite Components

Quality Assurance and Availability

It meets IPC-Class 2 standards, this PCB is available for worldwide shipping. The artwork is supplied in Gerber RS-274-X format, ensuring compatibility with standard PCB design processes.

With RF-10, you gain a reliable and high-performance PCB solution tailored for your advanced RF applications.

RF-10 PCB 60mil 2-Layer Immersion Silver Circuits

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Product Detail
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits
RF-10 PCB 60mil 2-Layer Immersion Silver Circuits

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Main Products :
RF PCB Board, Rogers PCB Board, PTFE PCB Board
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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