Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Material :
RF-60TC- 0.508 mm (20mil)
Layer count :
4-layer
PCB size :
200mm x 62mm=1PCS, +/- 0.15mm
PCB thickness :
0.6 mm
Copper weight :
1oz (1.4 mils) outer layers
Surface finish :
Immersion Gold
Description

We are excited to introduce our newly shipped PCB: the RF-60TC PCB. Designed specifically for the rigorous demands of RF and microwave applications, the RF-60TC PCB sets a new standard in high-frequency technology.

Key Features of RF-60TC PCBs

The RF-60TC PCB is constructed from a unique ceramic-filled, glass-reinforced PTFE laminate, providing numerous advantages over traditional materials. Key features include:

- High Thermal Conductivity: With thermal conductivity values up to 1.05 W/M*K (1 oz copper), the RF-60TC efficiently dissipates heat, crucial for maintaining performance in high power applications.

- Dielectric Constant of 6.15: At 10 GHz, this characteristic ensures excellent signal integrity and minimal signal loss.

- Low Dissipation Factor: A low dissipation factor of 0.002 at 10 GHz/23°C enhances efficiency, particularly in high-gain applications.

RF-60TC Typical Values
Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 6.15 ± 0.15 6.15 ± 0.15
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified) 0.002 0.002
TcK ppm/°C -3.581 ppm/°C -3.581
Dielectric Breakdown IPC-650 2.5.6 kV 55 kV 55
Dielectric Strength IPC-650 2.5.6.2 V/mil 550 V/mm 21,654
Arc Resistance IPC-650 2.5.1 Seconds >180 Seconds >180
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Flexural Strength (MD) IPC-650 2.4.4 psi 10,000 N/mm2 69
Flexural Strength (CD) IPC-650 2.4.4 psi 9,000 N/mm2 62
Tensile Strength (MD) IPC-650 2.4.19 psi 9,000 N/mm2 62
Tensile Strength (CD) IPC-650 2.4.19 psi 7,000 N/mm2 48
Young’s Modulus (MD) ASTM D 3039/IPC-TM-650 2.4.19 kpsi 721 N/mm2 4971
Poisson’s Ratio (MD) ASTM D 3039/IPC-TM-650 2.4.19 0.155 0.155
Peel Strength (1 oz. ED) IPC-650 2.4.8 lbs/in 8 N/mm 1.43
Thermal Conductivity (Unclad) IPC-650 2.4.50 W/M*K 0.9 W/M*K 0.9
Thermal Conductivity (CH/CH) IPC-650 2.4.50 W/M*K 1 W/M*K 1
Thermal Conductivity (C1/C1) IPC-650 2.4.50 W/M*K 1.05 W/M*K 1.05
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.01 mm/M 0.01
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.4 (After Bake) mils/in 0.69 mm/M 0.69
Dimensional Stability (MD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.06 mm/M 0.06
Dimensional Stability (CD) IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) mils/in 0.8 mm/M 0.8
Surface Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm 1.0 x 108 Mohm 1.0 x 108
Volume Resistivity IPC-650 2.5.17.1 (After Humidity) Mohm/cm 1.0 x 108 Mohm/cm 1.0 x 108
CTE (X, Y axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 9.9 ppm/°C 9.9
CTE (Z axis) IPC-650 2.4.41 (RT- 150 °C) ppm/°C 40 ppm/°C 40
Density (Specific Gravity) IPC-650 2.3.5 g/cm3 2.84 g/cm3 2.84
Specific Heat IPC-650 2.4.50 J/gK 0.94 J/gK 0.94
Td (2% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 930 °C 500
Td (5% Wt. Loss) IPC - 650 2.4.24.6 / TGA °F 960 °C 515
Flammability Rating UL 94 V-0 V-0

Thermal Conductivity and Its Importance

Effective thermal management is vital in high-frequency applications. The RF-60TC PCB's superior thermal conductivity enables lower operating temperatures, extending the lifespan of active components and improving long-term reliability. This feature is particularly beneficial in environments where heat buildup can compromise performance.

Dielectric Properties That Enhance Performance

The RF-60TC PCB boasts excellent dielectric properties, including a stable dielectric constant over frequency and temperature. With a thermal coefficient of dielectric constant (Dk) of -3.58 ppm/°C, the RF-60TC maintains signal integrity across a wide range of temperatures, making it suitable for diverse operational conditions.

Dimensional Stability for Complex Designs

One of the standout features of the RF-60TC PCB is its dimensional stability, with low thermal coefficients of expansion (CTE) of 9.9 ppm/°C (X/Y axis) and 40 ppm/°C (Z axis). This stability is essential for building high-layer count multilayer PCBs, ensuring reliable plated through hole connections and maintaining performance integrity throughout the PCB's lifespan.

Rigorous Quality Assurance Standards

At Bicheng, quality assurance is paramount. Each PCB from us undergoes comprehensive 100% electrical testing before shipment, adhering to IPC-Class-2 standards. This rigorous testing ensures that every PCB meets high-performance expectations, providing confidence to engineers and designers.

PCB Material: PTFE based, ceramic filled fiberglass
Designation: RF-60TC
Dielectric constant: 6.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..

Applications of RF-60TC PCBs in Various Industries

The versatility of the RF-60TC PCB allows it to excel in numerous applications, including:

- High Power Amplifiers: Ideal for RF power amplifiers that require efficient heat dissipation and reliable performance.

- Miniaturized Antennas: Perfect for compact designs, such as GPS antennas and RFID readers, where space is a premium.

- Filters, Couplers, and Dividers: Essential components in RF systems, the RF-60TC PCB supports advanced signal management.

- Satellite Communications: Designed to meet the demanding requirements of satellite technology, ensuring robust performance in critical applications.

Comparison with Traditional PCB Materials

Compared to traditional PCB materials, the RF-60TC offers superior performance characteristics. Its enhanced thermal conductivity, low dielectric losses, and dimensional stability make it a preferred choice for high-frequency applications, enabling engineers to push the boundaries of design and functionality.

2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications

Future Trends in PCB Technology

As the electronics industry continues to evolve, the demand for high-performance PCBs like the RF-60TC is expected to grow. Innovations in materials and manufacturing processes will lead to even more advanced solutions that enhance performance and reliability in RF and microwave applications.

Conclusion and Contact Information

At Bicheng, we are committed to providing high-frequency PCB solutions that meet the needs of modern electronic applications. The RF-60TC PCB represents a significant advancement in high-frequency technology, combining exceptional thermal management, low dielectric losses, and robust construction.

For more information or to discuss specific requirements, please contact our sales team at sales10@bichengpcb.com. We are dedicated to delivering the highest quality products and exceptional support to help you achieve your project goals.

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2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications

Ask Latest Price
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
2 Layer RF-60TC High Performance PCBs For RF And Microwave Applications

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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