We are excited to introduce our newly shipped PCB: the RF-60TC PCB. Designed specifically for the rigorous demands of RF and microwave applications, the RF-60TC PCB sets a new standard in high-frequency technology.
Key Features of RF-60TC PCBs
The RF-60TC PCB is constructed from a unique ceramic-filled, glass-reinforced PTFE laminate, providing numerous advantages over traditional materials. Key features include:
- High Thermal Conductivity: With thermal conductivity values up to 1.05 W/M*K (1 oz copper), the RF-60TC efficiently dissipates heat, crucial for maintaining performance in high power applications.
- Dielectric Constant of 6.15: At 10 GHz, this characteristic ensures excellent signal integrity and minimal signal loss.
- Low Dissipation Factor: A low dissipation factor of 0.002 at 10 GHz/23°C enhances efficiency, particularly in high-gain applications.
RF-60TC Typical Values | |||||
Property | Test Method | Unit | Value | Unit | Value |
Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 6.15 ± 0.15 | 6.15 ± 0.15 | ||
Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.002 | 0.002 | ||
TcK | ppm/°C | -3.581 | ppm/°C | -3.581 | |
Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 |
Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 |
Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 |
Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 |
Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 |
Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 |
Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 |
Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 |
Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.155 | 0.155 | ||
Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 |
Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 |
Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 |
Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 |
Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 |
Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 |
Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 |
CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 |
CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 |
Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 |
Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 |
Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 |
Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 |
Flammability Rating | UL 94 | V-0 | V-0 |
Thermal Conductivity and Its Importance
Effective thermal management is vital in high-frequency applications. The RF-60TC PCB's superior thermal conductivity enables lower operating temperatures, extending the lifespan of active components and improving long-term reliability. This feature is particularly beneficial in environments where heat buildup can compromise performance.
Dielectric Properties That Enhance Performance
The RF-60TC PCB boasts excellent dielectric properties, including a stable dielectric constant over frequency and temperature. With a thermal coefficient of dielectric constant (Dk) of -3.58 ppm/°C, the RF-60TC maintains signal integrity across a wide range of temperatures, making it suitable for diverse operational conditions.
Dimensional Stability for Complex Designs
One of the standout features of the RF-60TC PCB is its dimensional stability, with low thermal coefficients of expansion (CTE) of 9.9 ppm/°C (X/Y axis) and 40 ppm/°C (Z axis). This stability is essential for building high-layer count multilayer PCBs, ensuring reliable plated through hole connections and maintaining performance integrity throughout the PCB's lifespan.
Rigorous Quality Assurance Standards
At Bicheng, quality assurance is paramount. Each PCB from us undergoes comprehensive 100% electrical testing before shipment, adhering to IPC-Class-2 standards. This rigorous testing ensures that every PCB meets high-performance expectations, providing confidence to engineers and designers.
PCB Material: | PTFE based, ceramic filled fiberglass |
Designation: | RF-60TC |
Dielectric constant: | 6.15 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc.. |
Applications of RF-60TC PCBs in Various Industries
The versatility of the RF-60TC PCB allows it to excel in numerous applications, including:
- High Power Amplifiers: Ideal for RF power amplifiers that require efficient heat dissipation and reliable performance.
- Miniaturized Antennas: Perfect for compact designs, such as GPS antennas and RFID readers, where space is a premium.
- Filters, Couplers, and Dividers: Essential components in RF systems, the RF-60TC PCB supports advanced signal management.
- Satellite Communications: Designed to meet the demanding requirements of satellite technology, ensuring robust performance in critical applications.
Comparison with Traditional PCB Materials
Compared to traditional PCB materials, the RF-60TC offers superior performance characteristics. Its enhanced thermal conductivity, low dielectric losses, and dimensional stability make it a preferred choice for high-frequency applications, enabling engineers to push the boundaries of design and functionality.
Future Trends in PCB Technology
As the electronics industry continues to evolve, the demand for high-performance PCBs like the RF-60TC is expected to grow. Innovations in materials and manufacturing processes will lead to even more advanced solutions that enhance performance and reliability in RF and microwave applications.
Conclusion and Contact Information
At Bicheng, we are committed to providing high-frequency PCB solutions that meet the needs of modern electronic applications. The RF-60TC PCB represents a significant advancement in high-frequency technology, combining exceptional thermal management, low dielectric losses, and robust construction.
For more information or to discuss specific requirements, please contact our sales team at sales10@bichengpcb.com. We are dedicated to delivering the highest quality products and exceptional support to help you achieve your project goals.